1995
DOI: 10.1016/0921-5093(94)09640-6
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High temperature dynamic fatigue performance of a hot isostatically pressed silicon nitride

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Cited by 15 publications
(11 citation statements)
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“…The materials showed comparable creep properties in the same order of magnitude 74 . Furthermore, the SCG behavior of the SiO 2 ‐rich material (SiO 2 /Y 2 O 3 ratio of 2.12) seems to be comparable to the stress oxidation zone reported by Wereszczak et al 52–55 Whereas the amount of the grain‐boundary phase was different (5–6 vol% in NT 154 and 164, 10.5 vol% in the hot pressed material) the grain‐boundary phase composition with a SiO 2 /Y 2 O 3 ratio of >2 in both materials was nearly similar. In this way, the composition of crystalline and residual amorphous grain‐boundary phase seems to be more important than their overall amount in the sintering additive containing Si 3 N 4 , similar to the tendency described above for Si 3 N 4 without sintering additives.…”
Section: Silicon Nitride With Sintering Additivessupporting
confidence: 82%
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“…The materials showed comparable creep properties in the same order of magnitude 74 . Furthermore, the SCG behavior of the SiO 2 ‐rich material (SiO 2 /Y 2 O 3 ratio of 2.12) seems to be comparable to the stress oxidation zone reported by Wereszczak et al 52–55 Whereas the amount of the grain‐boundary phase was different (5–6 vol% in NT 154 and 164, 10.5 vol% in the hot pressed material) the grain‐boundary phase composition with a SiO 2 /Y 2 O 3 ratio of >2 in both materials was nearly similar. In this way, the composition of crystalline and residual amorphous grain‐boundary phase seems to be more important than their overall amount in the sintering additive containing Si 3 N 4 , similar to the tendency described above for Si 3 N 4 without sintering additives.…”
Section: Silicon Nitride With Sintering Additivessupporting
confidence: 82%
“…A first group with a comprehensive mechanical characterization is represented by various HIP qualities with only a small amount of Y 2 O 3 (4–6 wt%). Typical materials described in the literature 39–55 are…”
Section: Silicon Nitride With Sintering Additivesmentioning
confidence: 99%
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