2015 IEEE Aerospace Conference 2015
DOI: 10.1109/aero.2015.7118949
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High temperature die-attach materials for aerospace power electronics: Lifetime tests and modeling

Abstract: Increasing the temperature in power electronic applications usually causes a decreasing lifetime and reliability. This study shows that packaging materials and technologies, such as silver-sintering or gold germanium solders combined with silicon-carbide devices, can easily deal with temperatures above 200 °C/392 °F. Furthermore, lifetime tests (active power cycling) with 300 devices offered more cycles to failure at 120 °C/248 °F heat sink temperature than at 40 °C/104 °F (same ΔT) for silver-sintered samples… Show more

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Cited by 6 publications
(1 citation statement)
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“…With the continuous development and improvement of science and technology, traditional materials in some emerging industries have been far from satisfying the needs of the requirements. Especially in the eld of electronics and aerospace, the materials are required to have the properties of oxidation resistance, high-temperature resistance and wear resistance [1][2][3][4]. Although metal and alloy materials possess good toughness, machinability and conductivity, their wear resistance, corrosion resistance and high-temperature resistance are poor [5][6][7].…”
Section: Introductionmentioning
confidence: 99%
“…With the continuous development and improvement of science and technology, traditional materials in some emerging industries have been far from satisfying the needs of the requirements. Especially in the eld of electronics and aerospace, the materials are required to have the properties of oxidation resistance, high-temperature resistance and wear resistance [1][2][3][4]. Although metal and alloy materials possess good toughness, machinability and conductivity, their wear resistance, corrosion resistance and high-temperature resistance are poor [5][6][7].…”
Section: Introductionmentioning
confidence: 99%