High Temperature Characterization of Binary and Ternary Bi Alloys Microalloyed with Cu and Ag

Yu, Meiqi; Matsugi, Kazuhiro; Xu, Zhefeng; Choi, Yongbum; Yu, Jie; Motozuka, Satoshi; Nishimura, Yoshiyuki; Suetsugu, Kenichiro

doi:10.2320/matertrans.maw201710

Cited by 6 publications

(3 citation statements)

References 24 publications

(39 reference statements)

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“…The simulation results were parallel with the statement mentioned as figure 7 shows that the higher the temperature, the higher the maximum stress value. As the temperature increased during plastic deformation, the specimen would experience hardening and dynamic recovery simultaneously [25]. This resulted in the weakening of the hardening phenomenon due to dislocation annihilation that occurs more quickly than dislocation generation.…”

Section: Comparison Of Sn-58bi Mechanical Properties Under Different ...mentioning

confidence: 99%

Finite Element Analysis of Sn-58Bi Shear Test

Leong,

Amares

2023

J. Phys.: Conf. Ser.

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Finite element analysis (FEA) of quasi-static single lap shear test was conducted to study the mechanical properties of Sn-58Bi in terms of deformation, strain, stress, yield strength and ultimate strength. The study generated results of simulated behaviour of low temperature Sn-Bi solder alloy to address the demand of low temperature solder alloys in the electronic industry. The geometry was constructed in SolidWorks based on ASTM D1002 standard before being imported to ANSYS. The simulation was conducted at shear velocity of 0.1, 0.5, 1 and 1.27 mm/min and temperature of 138, 178, 208 and 238 °C using ANSYS. The simulation results were compared with the corresponding experimental results. Simulation results showed that an increase in shear velocity caused a decrease in ultimate strength and an increase in ductility of Sn-58Bi. As the velocity increased from 0.5 to 1.27 mm/min, the ultimate strength decreased from 339.87 to 291.24 MPa. This is predicted due to the Bi-rich layer within the lamellar structure of Sn-Bi alloy. An increase in temperature caused an increase in ultimate strength and brittleness in Sn-58Bi due to the trans-granular propagation of brittle failures along the weak Bi-abundant phase. As the temperature increased from 138 to 238°C, ultimate strength increased from 290.46 to 298.93 MPa.

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Section: Comparison Of Sn-58bi Mechanical Properties Under Different ...mentioning

confidence: 99%

Finite Element Analysis of Sn-58Bi Shear Test

Leong,

Amares

2023

J. Phys.: Conf. Ser.

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“…Bismuth alloys are being considered for use as Pb-free high-temperature [1] and low-temperature [2,3] solders due to their suitable melting interval. Bismuth is the least toxic heavy metal, but it has poor malleability, brittleness, and thermal conductivity [4,5].…”

Section: Introductionmentioning

confidence: 99%

Thermal transport properties and microstructure of the solid Bi-Cu alloys

Manasijević¹,

Balanović²,

Marković³

et al. 2022

Metall Mater Eng

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Thermal transport properties of solid Bi-Cu alloys have been investigated over a wide composition range and temperature range ranging from 25 to 250 °C. The flash method was used to determine thermal diffusivity. Thermal diffusivity was discovered to decrease continuously with increasing temperature and bismuth content. The indirect Archimedean method was used to determine the density of the Bi-Cu alloys at 25 °C. The obtained results show that the density of the studied alloys decreases slightly as the copper content increases. Thermal conductivity of the alloys was calculated using measured diffusivity, density, and a calculated specific heat capacity. The thermal conductivity of the studied Bi-Cu alloys decreases with increasing temperature and bismuth content, similar to thermal diffusivity. SEM with energy dispersive X-ray spectrometry (EDS) and differential scanning calorimetry (DSC) were used to examine the microstructure and melting behavior of Bi-Cu alloys, respectively. The eutectic temperature was measured to be 269.9±0.1 °C, and the measured phase transition temperatures and heat effects were compared to thermodynamic calculations using the CALPHAD method.

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“…The d-electrons concept based on the theoretical calculation of electronic structure theory proposed by Morinaga et al 17,18) has been applied to the design of the highperformance alloys such as Al, 15,1921) Bi, 22,23) Ni 2427) and Ti, 28,29) and some physical or chemical properties of the designed alloys were successfully predicted by this concept. 15) The bond order (Bo) and the d-orbital level of the transitional alloying element (Md) have been used in this concept.…”

Section: Introductionmentioning

confidence: 99%

Effect of Si Addition on Microstructure and Mechanical Properties of Al–1.5%Mn Alloys

Xiao

Matsugi

et al. 2020

Mater. Trans.

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Al1.5 mass%Mn was chosen as the base alloy, and 1.0 and 3.3Si were added to the base alloys, keeping the same values in the "Mk of sorbital energy level as those of Al1.5Mn0.8 and 2.4Mg alloys with superior tensile properties for as-cast applications. The Si addition or increment in the base alloy showed strengthened tensile behavior of the 0.2% proof stress (• 0.2 ) of 67 MPa and ultimate tensile strength (• UTS ) of 160 MPa, although there was reduced in fracture strain (¾ f ) to 9%. The increase and decrease in flow stress and strain, respectively, resulted from the increment in degree of solid solution strengthening by the increase of "Mk of the alloys. There was a good linear relationship between the nanoindentation hardness or rate of elastic deformation work in the ¡-Al phase and • 0.2 of the alloys. The dislocation density of Al1.5MnxSi alloys increased linearly as the "Mk-magnitude increased, compared with that of the base alloy. The behavior in the flow stress variation qualitatively agreed with that of dislocation density. There was a linear relationship between the lattice constant and Mk ¡ in Al1.5MnSi/Mg alloys. As the Mk ¡ changed, the • 0.2 of the alloys also increased and its increment rate was similar in both Si and Mg addition alloys. It may be considered that the trend of change in the lattice constant, • 0.2 , work hardening amount and dislocation density was predominantly consistent with that in the Mk ¡ or "Mk ¡ showing the indication of solid solution hardening level of the ¡-Al phase, and the effect of difference of third elements such as Si and Mg on their mechanical properties could be ignored in tensile examination procedures in this study.

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High Temperature Characterization of Binary and Ternary Bi Alloys Microalloyed with Cu and Ag

Cited by 6 publications

References 24 publications

Finite Element Analysis of Sn-58Bi Shear Test

Finite Element Analysis of Sn-58Bi Shear Test

Thermal transport properties and microstructure of the solid Bi-Cu alloys

Effect of Si Addition on Microstructure and Mechanical Properties of Al–1.5%Mn Alloys

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