Proceedings of the 19th International Symposium on Power Semiconductor Devices and IC's 2007
DOI: 10.1109/ispsd.2007.4294988
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High temperature behaviour of 3.5 kV 4H-SiC JBS diodes

Abstract: International audience4H-SiC JBS diodes have been manufactured on a Norstel epitaxied N/N+ substrate using a JTE as edge termination. A breakdown voltage higher than 3.5 kV has been measured on 0.16 and 2.56 mm2 diodes. The leakage current in the 25°C-300°C temperature range depends on the bipolar/Schottky ratio whereas in forward mode its impact is minor. Diodes have been stressed in DC mode to show that the 2.56 mm2 diodes have a slight forward voltage degradation independently of the layout. In switching mo… Show more

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Cited by 9 publications
(6 citation statements)
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“…As shown as example in Fig. , the maximum allowable current density of GaN 4.7 kV p–n diode is 90 A cm −2 , and its corresponding voltage is 3.36 V. The latter voltage, however, is comparable to that of a 4H‐SiC 3.5 kV junction‐barrier Schottky diode, i.e., 3.12 V . With respect to the characteristics of 6.5 kV insulated‐gate bipolar transistors (IGBTs), GaN devices might also have little room to compete against 4H‐SiC devices (Fig.…”
Section: Vertical Gan Bipolar Power Devicesmentioning
confidence: 99%
See 1 more Smart Citation
“…As shown as example in Fig. , the maximum allowable current density of GaN 4.7 kV p–n diode is 90 A cm −2 , and its corresponding voltage is 3.36 V. The latter voltage, however, is comparable to that of a 4H‐SiC 3.5 kV junction‐barrier Schottky diode, i.e., 3.12 V . With respect to the characteristics of 6.5 kV insulated‐gate bipolar transistors (IGBTs), GaN devices might also have little room to compete against 4H‐SiC devices (Fig.…”
Section: Vertical Gan Bipolar Power Devicesmentioning
confidence: 99%
“…Reported current–voltage characteristics of 4.7 kV GaN p–n diode , 4H‐SiC 3.5 kV junction barrier Schottky diode , and 4H‐SiC 6.5 kV insulated‐gate bipolar transistor , together with a curve showing the power dissipation‐limit of a semiconductor package, 300 W cm −2 .…”
Section: Vertical Gan Bipolar Power Devicesmentioning
confidence: 99%
“…[1][2][3][4] One SiC-based power device employed in power rectifier circuits is the diode which is categorized into Schottky barrier diode (SBD), p-i-n diode and junction barrier Schottky (JBS) diode. [5][6][7][8][9][10][11][12][13][14][15][16][17][18] SBD has a high switching speed because of its low threshold voltage but has a low breakdown voltage and high leakage current. On the other hand, p-i-n diodes can operate at high-bias and have low leakage current but also have large reverse-recovery current, whereas the JBS diode is designed to have similar characteristics with SBD in the forward-bias condition but with the p-i-n diode in the reverse bias condition.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, SiC‐SBD is a unipolar device driven by electron current only. Thus, there is no recovery current, and the recovery loss and the turn‐on loss are expected to be greatly reduced .…”
Section: Introductionmentioning
confidence: 99%