High-Speed Signal Optimization at Differential VIAs in Multilayer Printed Circuit Boards
Wen-Jie Xu,
Dong-Jin Xin,
Lei Yang
et al.
Abstract:The number of Printed Circuit Board (PCB) layers is continually increasing with the increase in data transmission rates, and the Signal Integrity (SI) of high-speed digital systems cannot be ignored. Introducing Vertical Interconnect Accesses (VIAs) in PCBs can realize the electrical connection between the top layer and the inner layers, however, VIAs represent one of the most important reasons for discontinuity between the PCBs and package. In this paper, a new optimization scheme for a differential VIA stub … Show more
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