High-speed chip-to-chip optical interconnect

Jelley, K.W.; Valliath, George; Stafford, John W.

doi:10.1109/68.163764

Cited by 7 publications

(3 citation statements)

References 4 publications

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“…In the case of power monitoring on integrated optical components (where only part of the channels need to be terminated) the use of such costly substrates can not be justified and a Si wafer board based hybrid integration approach is preferable. For this purpose, the definition of an out-of-plane coupling structure into the polymeric layer stack is required for which several methods have been reported, including laser ablation [15]- [16], microtoming [17], embossing [18], focused ion beam etching [19], sawing [20], and injection molding [21]. Because of the poor reproducibility or requirement of complicated equipment of these techniques, we have developed a novel integration concept [22] based on a micromachined Si submount with an integrated mirror (Fig.…”

Section: Pd Integration Conceptmentioning

confidence: 99%

High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components

Linden

Dobbelaere²,

Daele

et al. 1999

IEEE Trans. Adv. Packag.

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We report on a hybrid integration concept which allows high-density and alignment-tolerant surface mount assembly of top-illuminated photodetector (PD) arrays onto polymeric guided-wave components by means of a micromachined submount with an integrated mirror. This research aims at the development of polymeric waveguide based devices with an embedded optical power monitoring capability for applications in optical fiber communication networks. A prototype integrated multichannel optical power monitor comprising an eight-channel PD module and a polymeric waveguide splitter array was demonstrated which exhibited an average insertion loss of 5.2 dB, a PD coupling efficiency of 02.6 dB, and a crosstalk value of 017.1 dB between adjacent channels. Low polarization and wavelength sensitivity ( < 0.1 dB) was confirmed over a spectral range of 40 nm in both telecom wavelength windows. Index Terms-Hybrid integration, network monitoring and management, optical fiber communication, polymeric waveguide components, silicon micromachining.

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Section: Pd Integration Conceptmentioning

confidence: 99%

High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components

Linden

Dobbelaere²,

Daele

et al. 1999

IEEE Trans. Adv. Packag.

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“…Concepts for optical interconnect systems have long been present [3] . Barriers to industrial implementation center on the balance between performance improvements and reliability over existing metal interconnect systems.…”

Section: Introductionmentioning

confidence: 99%

Design and process issues affecting performance of optical interconnects on ICs

et al. 2000

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With the exponential increase in device densities and operating speeds, further improvements in chip performance are more difficult to achieve due to the physical limitations of conventional interconnects. Optical interconnects provide one of the solutions to continue improving performance of future technologies. Unlike other optical systems, the proposed approach requires minimal changes in conventional fabrication processes. Other major barriers to industry-wide acceptance are perceived limitations in performance. In this research, models have been developed to show that the performance of optical interconnects is a strong function of technology and layout.

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“…The solution for further enhancement of integrated circuits is sought in photonics, which is utilizing photons instead of electrons for data transfer. Chip-to-chip optical instead of electronic communication will not only completely solve the problems concerning the propagation delay, signal interference and heat dissipation in the metal wires, but also provide large information bandwidths [2][3][4][5]. The earliest research on optical circuits has been carried out during 1970s and the vision of a chip containing integrated optical components was proposed, as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

Growth and characterization of amorphous Si based multilayer structures

Kamyab¹

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First and foremost I offer my sincerest gratitude to my supervisor, Associate Professor Rusli, who has supported me throughout my thesis with his encouragement and knowledge. I am grateful for being given the opportunity to be his PhD student and for the genuine support he provided me with at each and every step of this journey. Every meeting with Professor Rusli for me was a source of new ideas, hope and motivation to move forward, to face the unknown and to appreciate every challenge and every success that came to my way. My special thanks go to my co-supervisor Dr. Yu Mingbin for his patient guidance and valuable comments during my work in IME. I would also like to acknowledge all technical staff in IME and NTU, specifically Mr. M. Fauzi and Ms. Seet Lye Ping in Characterization lab. Many thanks to Dr. Yang Hong for her help in ellipsometry measurements in Republic Polytechnic and to Mr. Sun Yongshun for his friendliness and continuous assistance since the first day I joined NTU. Last but not least, I'd like to thank my dear friend Miss Yasaman Kiasat for her companionship, heartfelt comfort and wise hints all through these years.

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High-speed chip-to-chip optical interconnect

Cited by 7 publications

References 4 publications

High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components

High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components

Design and process issues affecting performance of optical interconnects on ICs

Growth and characterization of amorphous Si based multilayer structures

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