2019
DOI: 10.1109/jlt.2019.2944098
|View full text |Cite
|
Sign up to set email alerts
|

High-Speed Avalanche Photodiodes With Wide Dynamic Range Performance

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
15
0

Year Published

2020
2020
2024
2024

Publication Types

Select...
8

Relationship

2
6

Authors

Journals

citations
Cited by 24 publications
(15 citation statements)
references
References 30 publications
0
15
0
Order By: Relevance
“…The thickness of each epi-layer is stated clearly in the figure. In order to facilitate a stepped electric field profile, the 500 nm thick multiplication (M-) layer is subdivided into two parts of 200 nm and 300 nm using additional charge control layer, as shown [10,11]. The electric field distribution within the device is simulated by using the Silvaco Technology Computer Aided Design (TCAD) tools 1 .…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The thickness of each epi-layer is stated clearly in the figure. In order to facilitate a stepped electric field profile, the 500 nm thick multiplication (M-) layer is subdivided into two parts of 200 nm and 300 nm using additional charge control layer, as shown [10,11]. The electric field distribution within the device is simulated by using the Silvaco Technology Computer Aided Design (TCAD) tools 1 .…”
Section: Introductionmentioning
confidence: 99%
“…Compared to device B with triple mesas, device A with the quadruple mesa structure provides better E-field confinement at the edge of the M-layer of the bottommost mesa. This is because the additional second mesa in device A, which is etched through the first field control (charge) layer and stops at first M-layer, can more effectively constrain the E-field below it [10,11]. Figures 2 (b) and (c) show the calculated electric fields of devices A and B along the horizontal directions at the first (BB') and second (CC') M-layers under a breakdown voltage of (-51 V).…”
Section: Introductionmentioning
confidence: 99%
“…They used an etched mesa-form p-type contact layer rather than a p-type selective doping region, eliminating uncertainty in the active region caused by selective diffusion or the ion-implantation process. This concept has been extended to other mesa-type APDs [15,16].…”
Section: Inverted P-down Designmentioning
confidence: 99%
“…They used an etched mesa-form p-type contact layer rather than a p-type selective doping region, eliminating uncertainty in the active region caused by selective diffusion or the ion-implantation process. This concept has been extended to other mesa-type APDs [15,16]. When we want to combine a hybrid absorber to boost the operating speed and sensitivity with the vertical illumination structure, however, we have to carefully consider the design.…”
Section: Inverted P-down Designmentioning
confidence: 99%
“…Regarding data transmission speed, it is relatively easy at present to achieve around 40 Gb/s (limited by the speed of electronics) with standard off-the-shelf telecom components for fiber optics communications at 1550 nm in a free-space optical link based on beam on/off sequential data transmission (on-off keying). Contrary to the case of the eavesdropping system, rather than an APD, a p-i-n photodiode that requires no quenching can be used in the receiver due to the higher light level received, although APD bandwidths of 16 GHz have been recently reported [27].…”
Section: Introductionmentioning
confidence: 99%