2018
DOI: 10.1049/mnl.2017.0728
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High sensitivity vanadium–vanadium pentoxide–aluminium metal–insulator–metal diode

Abstract: This work reports on the fabrication of an improved sensitivity metal-insulator-metal (MIM) diode. They devise an asymmetric structure diode that cascades vanadium, vanadium pentoxide, and aluminium (V-V 2 O 5-Al) thin film layers. The MIM diode is fabricated using electron-beam lithography, sputter deposition and metal liftoff techniques. X-ray photoelectron spectroscopy analysis is performed to determine the phase composition of the V 2 O 5 insulating thin film. Electrical characterisation of the fabricated … Show more

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Cited by 3 publications
(7 citation statements)
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References 38 publications
(34 reference statements)
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“…Other oxides that have been considered for inclusion in MIM diodes include ZnO [81,82], V 2 O 5 [20,83], SiO 2 [84,85], Nb 2 O 5 [86,87], CuO [8], TiO 2 [69], Cr 2 O 3 [88], HfO 2 [89] and Sc 2 O 3 [90]. A simple process for fabricating planar-type MIM tunneling diodes using electron beam writing and a boiling water oxidation process has been proposed, achieving high diode sensitivity of −31 V −1 for Poly Si/PolySi [85] and −14.5 V −1 for PolySi/Au electrodes [84] but too high R 0 .…”
Section: Single Insulator Mim Diodesmentioning
confidence: 99%
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“…Other oxides that have been considered for inclusion in MIM diodes include ZnO [81,82], V 2 O 5 [20,83], SiO 2 [84,85], Nb 2 O 5 [86,87], CuO [8], TiO 2 [69], Cr 2 O 3 [88], HfO 2 [89] and Sc 2 O 3 [90]. A simple process for fabricating planar-type MIM tunneling diodes using electron beam writing and a boiling water oxidation process has been proposed, achieving high diode sensitivity of −31 V −1 for Poly Si/PolySi [85] and −14.5 V −1 for PolySi/Au electrodes [84] but too high R 0 .…”
Section: Single Insulator Mim Diodesmentioning
confidence: 99%
“…The constraint of only growing a derivative oxide layer of the underlying polycrystalline metal can be resolved by directly depositing an insulator on the bottom metal electrode using different deposition techniques and thus facilitating the use of any type of bottom metal electrode irrespective of its native oxide formation properties. These deposition techniques include sputtering [14,17,20,27,28,45,51,59,74,80,83,90,97,98], electron beam evaporation [88] and atomic layer deposition [8,9,18,30,51,56,58,75,81,89,96,[99][100][101], as listed in Tables 2 and 3. Among these techniques, ALD offers the best quality oxides with low defect density, excellent conformality and uniformity.…”
Section: Permittivity and Scaling Issuesmentioning
confidence: 99%
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