High rate deep channel ablative formation by picosecond-nanosecond combined laser pulses

Klimentov, S. M.; Garnov, S. V.; Kononenko, T. V.; Konov, Vitalii I; Pivovarov, P. A.; Dausinger, Friedrich

doi:10.1007/s003390051493

Cited by 55 publications

(17 citation statements)

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“…Additionally employed were samples of ceramics of Si3N4. The list of laser radiation sources included Ti:Sa laser operating at the wavelength of 790 nm and repetition rate of 1 kHz allowing variation of the output pulse duration from 100 fs to 5 ps, Nd:YAP laser delivering 300 ps pulses, high repetition rate nanosecond Nd:YAG laser (up to 5 kHz) and an original Nd:YAG laser generating trains of nanosecond pulses with an equivalent ultra-high repetition rate of 150÷200 kI-Iz [8]. According to Fig.…”

Section: Experimental Schematics and Conditionsmentioning

confidence: 99%

Role of gas environment in the process of deep-hole drilling by ultrashort laser pulses

et al. 2003

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Fax: (0711) 6856842The detailed study of the role of air pressure in deep hole drilling by femtosecond and picosecond intense laser pulses (Ti:A1203 and Nd:YAP lasers) was performed in the range 1÷1000 mBar. Steel sample plates were mostly tested, experimental data obtained for ceramic materials is also presented. The following ablation parameters were measured and analyzed: ablation rates and their dependence on the channel depth, ablated crater morphology, optical transmission in channels after through hole formation. Both percussion and helical drilling regimes were used.Special attention was paid to two strong gas assisted effects typical of sub-picosecond and subnanosecond material ablation, which are low threshold gas breakdown in deep channels and nonlinear interaction of ultra-short intense pulses with air resulting in conical emission. Unwanted aspects of both phenomena were shown to disappear in a moderate vacuum of lOO mBar. A new approach to formation of such a vacuum in drilled channels was also proposed and experimentally modeled using ultra-high repetition rate nanosecond laser pulses.Keywords: laser ablation in air and vacuum, ultra-short pulses, deep channels, air breakdown, white light continuum generation, ultra-high repetition rate laser exposure

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Section: Experimental Schematics and Conditionsmentioning

confidence: 99%

Role of gas environment in the process of deep-hole drilling by ultrashort laser pulses

et al. 2003

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“…The key properties are beam quality and output power as well as compact design. The combination of enhanced capabilities for tailoring the optical energy density with new laser systems and improved processing strategies using the advanced picosecond and femtosecond lasers [17] leads to further improvement.…”

Section: Solid-state Pulsed Lasersmentioning

confidence: 99%

Laser beam machining (LBM), state of the art and new opportunities

Meijer

2004

Journal of Materials Processing Technology

351

122

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“…The key properties are beam quality and output power -improved simultaneously at high efficiency-as well as compact design. The combination of enhanced capabilities for tailoring the optical energy density with new laser systems and improved processing strategies using the advanced ps-lasers as well as lasers with only a few ns pulse duration [22] leads to further im provement. Actual developments enable new applications like marking in the middle of transparent materials as well as polishing of metal parts (Figure 4.5), micro machining of transparent material (Figures 4.7 and 4.8) with higher form accuracy and also generation of EUV radiation at 13 nm wavelength for next generation lithography.…”

Section: Overview Of Lasers and Application Fieldsmentioning

confidence: 99%

Laser Machining by short and ultrashort pulses, state of the art and new opportunities in the age of the photons

et al. 2002

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An overview is given of the applications of short and ultrashort lasers in material processing. Shorter pulses reduce heat-affected damage of the material and opens new ways for nanometer accuracy. Even forty years after the development of the laser there is a lot of effort in developing new and better performing lasers. The driving force is higher accuracy at reasonable cost, which is realised by compact systems delivering short laser pulses of high beam quality. Another trend is the shift towards shorter wavelengths, which are better absorbed by the material and which allows smaller feature sizes to be produced. Examples of new products, which became possible by this technique, are given. The trends in miniaturization as predicted by Moore and Taniguchi are expected to continue over the next decade too thanks to short and ultrashort laser machining techniques. After the age of steam and the age of electricity we have entered the age of photons now Keywords: Micro-machining, Laser, Ablation 101, (Figure 2.3) has simulated the interaction and ablation behaviour of aluminium, copper and silicon at 266 nm wavelength. The optical penetration depth was 7, 12 and 5 nm respectively. The applied power density was in the range of 5 to 50.109 W/cm2. It was found that the material evaporates as small particles (0.3-10 nm), most of them smaller than 1 nm. The average velocity of

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High rate deep channel ablative formation by picosecond-nanosecond combined laser pulses

Cited by 55 publications

References 1 publication

Role of gas environment in the process of deep-hole drilling by ultrashort laser pulses

Role of gas environment in the process of deep-hole drilling by ultrashort laser pulses

Laser beam machining (LBM), state of the art and new opportunities

Laser Machining by short and ultrashort pulses, state of the art and new opportunities in the age of the photons

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