High-quality plasma-assisted polishing of aluminum nitride ceramic

Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes. This review presents polishing approaches at atomic and close-to-atomic scale on planar and curved surfaces, including chemical mechanical polishing, plasma-assisted polishing, catalyst-referred etching, bonnet polishing, elastic emission machining, ion beam figuring, magnetorheological finishing, and fluid jet polishing. These polishing approaches are discussed in detail in terms of removal mechanisms, polishing systems, and industrial applications. The authors also offer perspectives for future studies to address existing and potential challenges and promote technological progress.

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“…This severely limits the application of PAP. For example, the achievable roughness is only 3 nm in Sa when applied to AIN [ 110 ].…”

Section: Chemical Modification Polishing Approachesmentioning

confidence: 99%

Polishing Approaches at Atomic and Close-to-Atomic Scale

2023

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“…The diamond abrasive size of compliant tools is directly proportional to the grinding force [12], and largersized abrasives are pulled out rst [23]. It is reported that the intergranular interaction between AlN grains is weak [13]. Experiments show that the grinding force produced by compliant tools with abrasive size of 3 µm and above is greater than the bond energy between AlN grains.…”

Section: Tool Wear and Materials Analysismentioning

confidence: 99%

“…However, the additional oxide layer is not required and may change its inherent properties in most cases. Sun et al employed the plasma to transfer the AlN to AlF 3 with the aid of CF 4 irradiation, and then this modi ed layer could be removed [13]. This process could obtain a very good surface quality with surface roughness of 3nm, while the procedure is relatively complicated and the removal e ciency is not high.…”

Section: Introductionmentioning

confidence: 99%

Process investigation of Aluminum Nitride ceramics based on compliant finishing tools

Han

Zhang²,

Gao³

et al. 2022

Preprint

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Aluminum Nitride (AlN), as a type of advanced functional ceramic material, has found wide applications in many fields, owing to its advantageous properties such as excellent thermal conductivity, high hardness and strength, etc. Nevertheless, these beneficial features bring great challenges to its machinability using current existing methods that commonly result in unsatisfactory surface qualities. In this paper, we investigated the processing performance of AlN by introducing the compliant bonnet finishing approach based on different tool bonding materials and abrasive sizes. The distinctive finishing qualities, material removal rates, tool wear behavior, etc., were studied and compared under various process conditions. Different from other ceramics, the resin bonded diamond tools with the abrasive size of 3 µm is found to be severely worn on AlN ceramic, and compliant tool with the smallest abrasive size of 1 µm greatly contributes to the generation of the near optical quality surface. The comparison with traditional rigid pellet finishing further demonstrates the advantageous finishing performances by using compliant tools on the AlN ceramics.

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“…Ceramic surfaces can be modified in various ways, including processing by ions and plasma [19], electron-beam irradiation [20][21][22][23], and laser radiation [24,25]. These methods Table 1.…”

Section: Introductionmentioning

confidence: 99%

Electron-Beam Processing of Aluminum-Containing Ceramics in the Forevacuum Pressure Range

Klimov,

Bakeev,

Zenin

2023

Ceramics

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Aluminum–ceramic materials based on Al2O3 and AlN are widely used in the electronics industry and, according to a number of electrophysical and technical and economic parameters, are among the most suitable for the production of electrical and radio engineering products. In this study, it is shown that the treatment of ceramics based on Al2O3 with an electron beam with a power of 200–1100 W and a current of 10–50 mA leads to heating of the ceramic surface to a temperature of 1700 °C. When heated to a temperature of 1500 °C and kept at this temperature for no more than 10 s, an increase in the roughness of the ceramic surface is observed by more than an order of magnitude. At the same time, for ceramic substrates based on aluminum nitride, an increase in the temperature of electron beam treatment from 1300 to 1700 °C leads to an increase in thermal conductivity from 1.5 to 2 times. The edge angle of water wetting of the AlN surface can vary from 20 to 100 degrees depending on the processing temperature, which allows one to control the transition of the material from a hydrophilic to a hydrophobic state. At the same time, electron beam exposure to Al2O3 does not change the wettability of this material so much. Electron beam processing in the forevacuum pressure region allows controlled changes in the electrophysical properties of ceramic materials based on Al2O3 and AlN.

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High-quality plasma-assisted polishing of aluminum nitride ceramic

Cited by 18 publications

References 17 publications

Polishing Approaches at Atomic and Close-to-Atomic Scale

Polishing Approaches at Atomic and Close-to-Atomic Scale

Process investigation of Aluminum Nitride ceramics based on compliant finishing tools

Electron-Beam Processing of Aluminum-Containing Ceramics in the Forevacuum Pressure Range

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