High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications

Murugesan, Kavin Senthil; Chernobryvko, Mykola; Zinal, Sherko; Rossi, Marco; Ndip, Ivan; Boettcher, M.; Lang, K.-D.; Wieland, Marcel; Goetze, Christian; Halim, Saquib Bin; Trewhella, Jean

doi:10.23919/eumc48046.2021.9337984

Cited by 10 publications

(2 citation statements)

References 8 publications

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“…The ABSIF software is based on: analytical expressions for low frequency inductanc calculations, based on the current sheet method [21][22][23][24][25][26][27]; analytical expressions for electr cal parameters and for high frequency were set up by the authors using the π equivalen electrical circuit method. This method implies the use of π models with concentrated pa rameters for each side of the spiral inductor [28][29][30][31][32][33][34].…”

Section: High Frequency Analysis Of Spiral Inductors By Means Of Absif Softwarementioning

confidence: 99%

High Frequency Analysis and Optimization of Planar Spiral Inductors Used in Microelectronic Circuits

et al. 2021

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This paper deals with high frequency analysis of spiral inductors, used in microelectronics circuits, to optimize their configuration. Software developed, designed, and implemented by the authors for nano and micrometre spiral inductor high frequency analysis, named ABSIF, is presented in this paper. ABSIF determines the inductance, quality factor, and electrical parameters for square, hexagonal, octagonal, and circular spiral inductors and their configuration optimization for energy efficiency. ABSIF is a good tool for spiral inductor design optimization in high frequency applications and takes into account the imposed technological limits and/or the designers’ constraints. A set of spiral inductors are considered and analysed for high frequency values using ABSIF, and the results are presented in the paper. The validation of ABSIF was completed by comparing the results with those obtained using a similar commercial software, Sonnet LiteTM, which is dedicated to high frequency electromagnetic analysis.

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Section: High Frequency Analysis Of Spiral Inductors By Means Of Absif Softwarementioning

confidence: 99%

High Frequency Analysis and Optimization of Planar Spiral Inductors Used in Microelectronic Circuits

et al. 2021

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“…Such structures can benefit from the advantageous shorter RF connection path to IC avoiding wire bonds or bumps, what is crucial in passive structures integration. Some research activities have already demonstrated the importance of passive components integration into a FoWLP showing an improved Q-factor [11], [12].…”

Section: Introductionmentioning

confidence: 99%

High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications

Chernobryvko,

Kaiser,

Murugesan

et al. 2024

IMAPSource Proceedings

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In this paper, a planar spiral resonator operating at 13 GHz is investigated. The resonator was fabricated using fan-out wafer level packaging (FoWLP) technology. The field analysis highlights the importance of via fence. Two thick film resistors suppress an undesired resonance in proximity of targeted one. The measurements demonstrate a very good correlation in comparison with full-wave simulations. The measured Q-factor defined based on analysis of feedback oscillatory system is about 48. The proposed configuration is suitable for voltage-controlled oscillators (VCOs) with a resonator realized in package.

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Temperature dependent Dielectric Characterization of Low Loss Thin Film Polymer up to sub-THz bands

Murugesan,

Schneider,

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications

Cited by 10 publications

References 8 publications

High Frequency Analysis and Optimization of Planar Spiral Inductors Used in Microelectronic Circuits

High Frequency Analysis and Optimization of Planar Spiral Inductors Used in Microelectronic Circuits

High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications

Temperature dependent Dielectric Characterization of Low Loss Thin Film Polymer up to sub-THz bands

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