1982
DOI: 10.1049/el:19820586
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High-quality InP surface corrugations for 1.55 μm InGaAsP DFB lasers fabricated using electron-beam lithography

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Cited by 17 publications
(3 citation statements)
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“…The grating can be fabricated either by using a holographic technique based on laser beam interference [2], [3] or by using electron beam lithography (EBL) [4]. EBL has many advantages compared to holographic methods.…”
Section: Introductionmentioning
confidence: 99%
“…The grating can be fabricated either by using a holographic technique based on laser beam interference [2], [3] or by using electron beam lithography (EBL) [4]. EBL has many advantages compared to holographic methods.…”
Section: Introductionmentioning
confidence: 99%
“…In most cases, these impurities and defects affect the electrical properties of the crystals, and therefore have a significant effect on the performance of electronic devices. Although there have been a large number of experimental investigations (1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13) to study the energy levels arising from these impurities and defects and their carrier trapping and emitting properties by means of capacitance transient techniques such as deep-level transient spectroscopy (DLTS) (14), relatively little work has been accomplished so far on the effects of such electrically active centers on the electrical properties of silicon crystals (15)(16)(17)(18)(19)(20)(21). However, the results of such work would indeed be very helpful to design the optimum fabrication process of desirable devices.…”
Section: Introductionmentioning
confidence: 99%
“…Traces of resist are often trapped inside the narrow grooves between gratings and can lead to an inferior epitaxial growth in subsequent processing. Oxygen plasma (8) is generally used to clean the residual resists, and the typical conditions in a barreltype reactor are 100% 02 at 200 mtorr for 20 rain at a plasma input power of 300W. However, reaction by-products from the oxygen plasma are usually found redeposited on the grating surface (9) and a wet chemical cleaning process must be used to remove these reaction by-products.…”
mentioning
confidence: 99%