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2014
DOI: 10.1039/c3ce42231c
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High quality InP nanopyramidal frusta on Si

Abstract: Octagonal nanopyramidal InP frusta grown selectively on silicon.

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Cited by 4 publications
(5 citation statements)
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“…Two types of samples are used in these experiments, InP seed on Si and InP substrates. To facilitate SAG, ~ 150 nm thick SiO 2 mask is deposited using PECVD and soft UV- NIL is used for pattern definition (17). Nano sized circular openings with varying diameters and pitches are defined by standard reactive ion etching (RIE) of SiO 2 mask using photoresist as an etch mask.…”
Section: Nano Pyramidal Frusta Of Inp On Simentioning
confidence: 99%
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“…Two types of samples are used in these experiments, InP seed on Si and InP substrates. To facilitate SAG, ~ 150 nm thick SiO 2 mask is deposited using PECVD and soft UV- NIL is used for pattern definition (17). Nano sized circular openings with varying diameters and pitches are defined by standard reactive ion etching (RIE) of SiO 2 mask using photoresist as an etch mask.…”
Section: Nano Pyramidal Frusta Of Inp On Simentioning
confidence: 99%
“…The eight sides surrounding the top flat surface are low index facets. The exact index of these facets is revealed by the line scan of NPF sidewalls using AFM, which resulted in two angles, 54° for {111} planes and 45° for {110} planes (17). Incorporation of growth rate determining species in these confined areas during HVPE growth controls the crystal symmetry rearrangement that results in the formation of these planes (26).…”
Section: Nano Pyramidal Frusta Of Inp On Simentioning
confidence: 99%
See 2 more Smart Citations
“…For example, improved manufacturing paths have enabled the fabrication of low-loss passive devices such as filters, waveguides, beam splitters and combiners, which are now standard available devices. [1][2][3][4] However, the development of active devices and, in particular, the integration of efficient light sources remain an open engineering challenge as far as heat dissipation is concerned. The successful fabrication of such integrated de-vices holds the key to accomplishing the long-term dream of the photonics and electronics industries: a fully integrated III-V/Si platform.…”
Section: Introductionmentioning
confidence: 99%