1998
DOI: 10.1016/s0022-0248(98)00169-9
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High-quality InGaN MQW on low-dislocation-density GaN substrate grown by hydride vapor-phase epitaxy

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Cited by 87 publications
(53 citation statements)
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“…The higher threshold current density is probably caused by the large number of TD density of 1 ϫ 10 7 cm Ϫ2 at the window region. It was reported that the TD served as a diffusion pathway of metals, and did as a leakage current pathway in InGaN and GaN (57,58). Thus, it is possible that a leakage current due to a large number of TDs caused the high threshold current density on the window region.…”
Section: S P E C I a L S E C T I O N C O N T R O L A N D U S E O F D mentioning
confidence: 99%
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“…The higher threshold current density is probably caused by the large number of TD density of 1 ϫ 10 7 cm Ϫ2 at the window region. It was reported that the TD served as a diffusion pathway of metals, and did as a leakage current pathway in InGaN and GaN (57,58). Thus, it is possible that a leakage current due to a large number of TDs caused the high threshold current density on the window region.…”
Section: S P E C I a L S E C T I O N C O N T R O L A N D U S E O F D mentioning
confidence: 99%
“…Recently, it was confirmed that these TDs affect device performance. The TDs served as a diffusion pathway of metals and acted as a leakage current pathway in InGaN and GaN (57,58). For InGaN layer, an open hexagonal inverted pyramid called "V-defect" (59), spatial inhomogeneities of In composition (60,61), and pit formations (62,63) initiated at TDs in GaN film were reported.…”
mentioning
confidence: 99%
“…3,4 The interfacial energy difference between sapphire and GaN could cause large amount of dislocations and low crystal quality of the subsequently grown GaN layer. 5 The degraded quality of GaN layers presents intensive nonradiative recombination centers severely reducing the efficiency. 6 For the purpose of decreasing the energy difference from lattice constant and thermal expansion coefficient mismatch between sapphire substrates and GaN, early pioneers applied in-situ low temperature AlN or GaN film to form the nucleation layer which provide a stable surface condition to grow the following bulk GaN.…”
mentioning
confidence: 99%
“…The higher threshold current density is probably caused by the large number of TD density of 1 x 10 7 cm -2 at the window region. It was reported that the TD served as a diffusion pathway of metals, and did as a leakage current pathway in InGaN and GaN [49,50]. Thus, there is a possibility that a leakage current due to a large number of TDs caused the high threshold current density on the window region.…”
Section: Ingan-based Violet Ldsmentioning
confidence: 99%