1980
DOI: 10.1016/0040-6090(80)90077-2
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High quality dielectric film for distributed RC filters and amorphous semiconductors

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1981
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Cited by 6 publications
(1 citation statement)
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“…Under the constant anodization voltage of 2.3 V, it took about 6, 4 and 3 min for electrodes A, B and C to reach the current density below 0.01 mA cm −2 in order to stop the anodization process. Since the anodization ratio is [21,22], an anodization voltage of 2.3 V corresponds to an estimated Al x O y thickness of ∼3 nm. To fabricate IGZO TFTs, a 20 nm thick IGZO (In 2 O 3 : Ga 2 O 3 : ZnO = 1: 1: 1 mol%) channel layer was deposited by radio frequency (RF) magnetron sputtering at room temperature on the anodized Al x O y dielectrics.…”
Section: Methodsmentioning
confidence: 99%
“…Under the constant anodization voltage of 2.3 V, it took about 6, 4 and 3 min for electrodes A, B and C to reach the current density below 0.01 mA cm −2 in order to stop the anodization process. Since the anodization ratio is [21,22], an anodization voltage of 2.3 V corresponds to an estimated Al x O y thickness of ∼3 nm. To fabricate IGZO TFTs, a 20 nm thick IGZO (In 2 O 3 : Ga 2 O 3 : ZnO = 1: 1: 1 mol%) channel layer was deposited by radio frequency (RF) magnetron sputtering at room temperature on the anodized Al x O y dielectrics.…”
Section: Methodsmentioning
confidence: 99%