High purity diamond films synthesised by chemical vapour deposition

Abstract

Defect free diamond films have tremendous potential in a variety of areas including optoelectronics and have been the focus of several studies. Before diamond growth, a seeding treatment to substrate is mandatory, which itself is a source of contamination and degrades the quality of diamond. In the present study, diamond films without seeding treatment were grown on silicon using hot filament chemical vapour deposition. As a result of dry ultrasonic process, the diamond film with continuous layer was grown over unseeded substrate. At nucleation stage, carbon containing species were trapped by the uniformly created network of pits. Film grown at 2?0 vol.-% CH 4 in H 2 and substrate temperature of 850uC showed higher purity than that grown at 3?0 vol.-%CH 4 in H 2 and substrate temperature of 1000uC. Films grown over seedless substrates were also compared with those grown with seeding treatment.

Wear behaviour of gradient-multilayer diamond coatings deposited on cemented-carbide substrates

“…Residual stress calculations were performed by observing the displacement offset of the diamond peaks (measured position versus theoretical/literature position). Equation (2) was used to determine the residual stress in the coatings [27]: where v is the position of the actual diamond peak in the coating and v 0 is the position of diamond peaks at 1332 cm −1 . If the calculated result is negative, it means that the stress is compressive in nature, while if the result is positive, the stress is considered to be tensile.…”

“…Residual stress calculations were performed by observing the displacement offset of the diamond peaks (measured position versus theoretical/literature position). Equation ( 2) was used to determine the residual stress in the coatings [27]:…”

Processing and Mechanism of Dynamic Friction Polishing Diamond Using Manganese-Based Alloy

“…[1,2]. The successful development of chemical vapor deposition (CVD) [3] diamond film alleviates the problem that natural diamond is scarce and expensive. However, because of its special growth characteristic of polycrystalline orientation, the surface of CVD diamond film is too rough to be directly used in production and processing.…”

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

“…Several deposition techniques are used to deposit thin (<1 μm) and thick (>1 μm) copper films. Physicalvapour-deposition (PVD) processes [17][18][19][20], like sputtering [21][22][23][24][25] and electron beam evaporation [26][27][28][29], Chemical-vapour-deposition (CVD) [30][31][32][33][34], atomic layer deposition (ALD) [35][36][37][38] methods are used to deposit high-quality, defect-free, continuous films; however, the average thickness of deposited films is generally less than 1 μm. Electroplating is used in those applications where the thick blanket film is required or blind/through holes must be filled.…”