2004
DOI: 10.1016/j.jcrysgro.2004.08.098
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High-power laser structures grown on bulk GaN crystals

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Cited by 15 publications
(11 citation statements)
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“…Epitaxial AlGaN/InGaN layers were deposited on the wafers by MOCVD according to procedures described elsewhere [28]. Vertical metallic contacts were deposited by sputtering and were subsequently annealed to achieve ohmic behavior.…”
Section: Article In Pressmentioning
confidence: 99%
“…Epitaxial AlGaN/InGaN layers were deposited on the wafers by MOCVD according to procedures described elsewhere [28]. Vertical metallic contacts were deposited by sputtering and were subsequently annealed to achieve ohmic behavior.…”
Section: Article In Pressmentioning
confidence: 99%
“…The availability of native GaN substrates of very low defect density is essential for improving the performance, yield and lifetime of optoelectronic and electronic GaN-based devices [1,2], in particular reliability of high-power laser diodes [3]. A promising method for obtaining high-quality GaN bulk single crystals is solution growth using supercritical ammonia as a solvent, i.e., the ammonothermal method.…”
Section: Introductionmentioning
confidence: 99%
“…Generally, the epitaxial growth of III-nitrides has focused on the improvement of optical and crystal qualities of InGaN multi-quantum wells (MQWs) since they are used as active medium of AlInGaN-based laser diodes (LDs) as a lighting source for optical storage system and mobile display systems [1][2][3][4][5][6][7]. Recently, although the reliability of AlInGaN-based LDs has been drastically improved by the introduction of GaN substrate with low dislocation density, there are some reliability problems in the AlInGaN-based LD/LEDs [1].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, although the reliability of AlInGaN-based LDs has been drastically improved by the introduction of GaN substrate with low dislocation density, there are some reliability problems in the AlInGaN-based LD/LEDs [1]. The reliability of device is determined by the weakest part of the device and depends on factors ranging from material properties to processing technologies.…”
Section: Introductionmentioning
confidence: 99%