2018 IEEE Applied Power Electronics Conference and Exposition (APEC) 2018
DOI: 10.1109/apec.2018.8341119
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High power 3-phase to 3-phase matrix converter using dual-gate GaN bidirectional switches

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Cited by 34 publications
(16 citation statements)
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“…15(a)). Hence, the four gate signals s Ti,lp and s Ti,ln are generated according to a current sign dependent multi-step commutation strategy [23], as illustrated in the lower part of Fig. 17(b) and (c) for the case of i dc > 0.…”
Section: Discussionmentioning
confidence: 99%
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“…15(a)). Hence, the four gate signals s Ti,lp and s Ti,ln are generated according to a current sign dependent multi-step commutation strategy [23], as illustrated in the lower part of Fig. 17(b) and (c) for the case of i dc > 0.…”
Section: Discussionmentioning
confidence: 99%
“…The power devices selected for the realization of the 3-Φ inverter are ±600 V 26 mΩ 2G MB GaN e-FETs [23]. The main characteristics of this switch (currently only available as research sample) are compared in Table II with the ones of the best-in-the-market conventional GaN power transistor in the same voltage class, i.e., a 650 V 25 mΩ GaN e-FET [42].…”
Section: A Dual-gate Monolithic Bidirectional Gan E-fetmentioning
confidence: 99%
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“…This effectively addresses the problem of having two semiconductor devices (transistors or diodes) in series with the current path, resulting in reduced conduction losses. A matrix converter with 98% efficiency using GaN Bidirectional switches has been demonstrated in [156] where the characteristics of this switch are compared to the typical IGBT + Diode-based switch. As briefly approached on this work, developments on semiconductor technologies will have significant impact on the successful industrial penetration of matrix converterbased solutions for the promising future applications described throughout this work, to tackle the MC main challenges of higher efficiency and higher voltage operation capability.…”
Section: Challenges and Research Needs Of Matrix Convertersmentioning
confidence: 99%
“…In relation to the BDS conformed by two IGBTs, the common-emitter configuration is preferred instead of the common-collector because of implementation issues, as established in [1]. Another BDS configurations based on new power transistor technologies like Gallium Nitride (GaN), Silicon carbide Metal-Oxide-Semiconductor Field-Effect Transistors (Sic-MOSFETs), Silicon carbide Junction Field-Effect Transistors (Sic-JFETs), etc., have been recently proposed, but it is still necessary to utilize a two-transistor configuration [5][6][7][8]. The BDS control in the MC represents a fundamental task due to the lack of a natural freewheeling path for the electrical current; therefore, the commutation must be actively controlled all the time to overcome undesirable and destructive conditions, as those that will be described below.…”
Section: Introductionmentioning
confidence: 99%