High performance write head using NiFe 45/55

Robertson, Neil; Hu, Ben; Tsang, C.

doi:10.1109/20.617741

Cited by 88 publications

(24 citation statements)

References 4 publications

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“…In the beginning, the alloy of choice was Ni 81 Fe 19 (Permalloy) with saturation magnetic flux density, B s = 1 [T] [1]. The later development was followed by Ni 45 Fe 55 alloys with 60% higher B s values [2], and ternary CoFeNi alloys with lower Ni content and B s ranging between 1. 6 [T] and 2.2 [T] [3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

The effect of Fe3+ on magnetic moment of electrodeposited CoFe alloys—Experimental study and analytical model

Brankovic

Bae

Litvinov

2008

Electrochimica Acta

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Section: Introductionmentioning

confidence: 99%

The effect of Fe3+ on magnetic moment of electrodeposited CoFe alloys—Experimental study and analytical model

Brankovic

Bae

Litvinov

2008

Electrochimica Acta

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“…27.2). The further development of electrodeposited soft magnetic alloys went by introduction of Ni 45 Fe 55 with 70% higher B s values [9] (magnetoresistive read heads) and ternary CoFeNi alloys with Co content larger than Ni and Fe and B s ranging between 1.6 and 2.2 T [10][11][12] [giant magnetoresistive (GMR) read heads]. However, the recent introduction of the perpendicular magnetic recording geometry [13] and magnetic media with significantly larger anisotropy and coercivities requires soft magnetic alloys with the highest magnetic moment possible.…”

Section: Magnetic Recordingmentioning

confidence: 99%

“…The sources of anions in the plating baths are also different buffer systems [23] used to moderate pH fluctuations in the bulk and to some extent ensure stability of the electrochemical interface [24]. The commonly used ones are H 3 BO 3 , NH 4 Cl, (NH4) 2 SO 4 , and CH 3 COOH [2,3,[9][10][11], but other more exotic buffers systems can be found as well. A useful test in choosing the anion-metal cation combination is based on linear sweep voltammetry measurements where the solutions with the same concentrations of metal ions and pH are compared having different anions.…”

Section: General Approach To Bath Designmentioning

confidence: 99%

Applications to Magnetic Recording and Microelectronic Technologies

Brankovic¹,

Vasiljević²,

Dimitrov³

2010

Modern Electroplating

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Early applications of electrodeposition in manufacturing were mainly confined to situations where relatively thick polycrystalline metal deposits were needed. These included protective or sacrificial metal layers for corrosion protection, decorative applications, and situations where metal coatings with specific mechanical properties were needed [1]. However, development of theoretical foundations in electrochemical engineering and electrometallurgy and the sophistication of the tools used for electrodeposition have contributed to widespread electrodeposition in high-tech industry where more rigorous thickness control of the deposit is required. Nowadays, electrodeposition is recognized as a mature deposition method for the fabrication of magnetic thin-film heads [2, 3] and in microelectronics and microelectromechanical system (MEMS) technologies [4][5][6][7]. The most recent developments suggest that electrodeposition is an attractive fabrication process for many emerging fields of nanotechnology. These new applications make the future of electrodeposition research a seemingly interesting and quite exciting endeavor.In this chapter we will review the most important electrodeposition processes used for fabrication of magnetic recording heads and in microelectronics technology. The most important parameters, criteria, and phenomena controlling the deposit morphology and properties are highlighted and discussed using the examples from the authors' own work and from the work of other prominent groups around the world. MAGNETIC RECORDINGNowadays electrodeposition is used for the fabrication of many important parts of magnetic recording heads, including magnetic shields and poles, Cu coils, and for connecting Cu studs, leads and pads, Au interconnects, and nonmagnetic gaps and coatings. Some of these electrodeposition processes and bath chemistries were adopted from other technologies as a common practice. However, the fabrication of the writing pole in magnetic recording heads has been the most important manufacturing step where electrodeposition has gained its fame as a cost-effective, reliable, and high-throughput operation (Fig. 27.1a). Over the years, the development of magnetic reader technologies, recording medias and the geometry of the magnetic recording process have posed many challenges that electrodeposition had to meet in order to stay competitive with other deposition methods. The common requirement for the alloys for magnetic pole fabrication is that they have low coercivity (softness), low magnetostriction (l % 0), and relatively high magnetic moment. The electrodeposition process of these alloys has to be scalable with high-throughput manufacturing with minimum effort in process control and reproducibility. The bath chemistry has to be stable over the time and compatible with other materials and processes used in through-mask fabrication.In the very beginning, the electrodeposited magnetic alloy for magnetic pole application was Ni 81 Fe 19 -Permalloy (inductive read heads)-with saturation magnetic fl...

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“…Each magnetic inductor contained an electroplated copper coil enclosed by the electroplated Ni 45 Fe 55 yokes; air-core inductors were also fabricated. The Ni 45 Fe 55 material was chosen for its relatively high magnetic moment, high anisotropy field, and relatively high electrical resistivity; it was first introduced into thin film heads by IBM in 1997 [31], and it was also recently employed in on-chip inductors [32,33]. Measurements of the magnetic properties of the electroplated yoke materials will be described, including high frequency permeability measurements.…”

Section: Magnetic Clad Power Inductors For Integrated Powermentioning

confidence: 99%

Recovery Act: Integrated DC-DC Conversion for Energy-Efficient Multicore Processors

Shepard¹

2013

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High performance write head using NiFe 45/55

Cited by 88 publications

References 4 publications

The effect of Fe3+ on magnetic moment of electrodeposited CoFe alloys—Experimental study and analytical model

The effect of Fe3+ on magnetic moment of electrodeposited CoFe alloys—Experimental study and analytical model

Applications to Magnetic Recording and Microelectronic Technologies

Recovery Act: Integrated DC-DC Conversion for Energy-Efficient Multicore Processors

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