High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express
Debendra Das Sharma,
Gerald Pasdast,
Sathya Tiagaraj
et al.
Abstract:Universal chiplet interconnect express (UCIe) is an open industry standard interconnect for a chiplet ecosystem in which chiplets from multiple suppliers can be packaged together. The UCIe 1.0 specification defines interoperability using standard and advanced packaging technologies with planar interconnects. Here we examine the development of UCIe as the bump interconnect pitches reduce with advances in packaging technologies for three-dimensional integration of chiplets. We report a die-to-die solution for th… Show more
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