2014
DOI: 10.1038/srep06430
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High performance organic transistor active-matrix driver developed on paper substrate

Abstract: The fabrication of electronic circuits on unconventional substrates largely broadens their application areas. For example, green electronics achieved through utilization of biodegradable or recyclable substrates, can mitigate the solid waste problems that arise at the end of their lifespan. Here, we combine screen-printing, high precision laser drilling and thermal evaporation, to fabricate organic field effect transistor (OFET) active-matrix (AM) arrays onto standard printer paper. The devices show a mobility… Show more

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Cited by 111 publications
(72 citation statements)
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“…Using the same deposited source-drain and gate electrodes as read and address lines, respectively, and a gate dielectric layer between these lines, simplifies the fabrication process and is commonplace for both lithographically processed 10,15,19,26,29,30 and printed device arrays [31][32][33] . However, highly resistive read lines may result from source-drain electrodes typically not being optimized for conductivity but rather for charge injection and extraction from the semiconductor.…”
Section: Pierre * Abhinav Gaikwad and Ana Claudia Ariasmentioning
confidence: 99%
“…Using the same deposited source-drain and gate electrodes as read and address lines, respectively, and a gate dielectric layer between these lines, simplifies the fabrication process and is commonplace for both lithographically processed 10,15,19,26,29,30 and printed device arrays [31][32][33] . However, highly resistive read lines may result from source-drain electrodes typically not being optimized for conductivity but rather for charge injection and extraction from the semiconductor.…”
Section: Pierre * Abhinav Gaikwad and Ana Claudia Ariasmentioning
confidence: 99%
“…Highly bendable OFET matrix was demonstrated on ultrathin parylene-C substrates using printed silver (Ag) nanoparticle interconnectors [145], on paper substrates assisted by a lithographic method [38,57], on mesh-like substrates [167] and even by substrate-free a) Solution-processable; b) not available; c) with a freestanding gate insulator/dielectric layer; d) with an encapsulation layer freestanding method [70]. Foldable OFET arrays applicable on both plastics and glass can be realized by using engineered substrates with nonuniform thickness, with thin areas for easy folding and thick areas for easy handling [168].…”
Section: Ultraflexilbe Organic Semiconductor Devicesmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8][9] Generally, the thickness of organic semiconductor layer in organic electronic devices is in the range of several tens of to hundreds of nanometer (nm), which consists of tens of or more molecular layers. [10][11][12][13][14][15][16] On the other hand, ultrathin film (< 15 nm, Figure 1a) of organic semiconductors represents a kind of nano-scale film consisting of monolayer to few molecular layers (Figure 1b).…”
Section: Introductionmentioning
confidence: 99%