2020
DOI: 10.1016/j.xcrp.2020.100263
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High-Performance n-type SnSe Thermoelectric Polycrystal Prepared by Arc-Melting

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Cited by 28 publications
(29 citation statements)
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“…A mixture of stoichiometric amounts of Sn and Se powder metals, and KH as a source of K, was pelletized under N 2 atmosphere in a glove box; the pellets were arc-molten under Ar atmosphere in a watercooled Cu crucible, leading to compact ingots, which were ground to powder for structural characterization, or cold-pressed into regular disk-shaped specimens for transport measurements. Cold-pressing SnSe is sufficient for decent thermoelectric performance [77,86]; it provides samples with about 90% of the crystallographic density thanks to its malleability. On the contrary, more typical consolidation techniques, such as hot pressing [87] or spark plasma sintering [21,85], would yield higher densities but tend to deteriorate the electrical and thermal conductivities, mainly by causing intergrain oxide growth [88].…”
Section: Methodsmentioning
confidence: 99%
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“…A mixture of stoichiometric amounts of Sn and Se powder metals, and KH as a source of K, was pelletized under N 2 atmosphere in a glove box; the pellets were arc-molten under Ar atmosphere in a watercooled Cu crucible, leading to compact ingots, which were ground to powder for structural characterization, or cold-pressed into regular disk-shaped specimens for transport measurements. Cold-pressing SnSe is sufficient for decent thermoelectric performance [77,86]; it provides samples with about 90% of the crystallographic density thanks to its malleability. On the contrary, more typical consolidation techniques, such as hot pressing [87] or spark plasma sintering [21,85], would yield higher densities but tend to deteriorate the electrical and thermal conductivities, mainly by causing intergrain oxide growth [88].…”
Section: Methodsmentioning
confidence: 99%
“…The resistivity near room temperature is about one order of magnitude lower than the resistivity of pristine SnSe; however, at high temperature, the undoped compound shows a dramatic decrease that is not mirrored by the samples doped with potassium. Among them, SnSe:K 0.05 shows the lowest resistivity, reaching 10 -3 X m at 780 K, whereas the Seebeck coefficient of the undoped SnSe made by arc-melting shows a change of sign reflecting a p-ton-type transition [77], it does not happen in any of the K-doped compounds, as they remain firmly p-type. The Seebeck coefficient of the SnSe:K x samples remains at around * 200 lV/K until it drops above * 700 K, indicating the start of bipolar conduction.…”
Section: Thermoelectric Transport Propertiesmentioning
confidence: 98%
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“…This is because the improved technology mentioned above generally reduces the Seebeck coefficient by moving the Fermi level to the edge of the conductor [ 29 ]. For this reason, numerous studies have been conducted to improve the TE properties of polymer-based materials by introducing inorganic TE materials with a high Seebeck coefficient (e.g., Bi 2 Te 3 , SnSe, and Cu 2 SnSe 3 ) [ 30 , 31 , 32 ]. For instance, Ge et al [ 32 ] produced a Cu 2 SnSe 3 /PEDOT:PSS composite via spark plasma sintering to improve the TE properties.…”
Section: Introductionmentioning
confidence: 99%