High Performance Multi-Chip Leadframe Package with Internal Connection

Park, DaeYoung; Jeon, HyeongIl; Gijeong, Kim,; Yang, Ji-Yeon; Sang, KwangSoo; Kim, ByongJin; Khim, JinYoung

doi:10.1109/eptc56328.2022.10013282

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022

DOI: 10.1109/eptc56328.2022.10013282

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High Performance Multi-Chip Leadframe Package with Internal Connection

DaeYoung Park¹,

HyeongIl Jeon²,

Kim, Gijeong³

et al.

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High Performance Multi-Chip Leadframe Package with Internal Connection

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