35th AIAA Thermophysics Conference 2001
DOI: 10.2514/6.2001-3080
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High performance miniature heat pipe

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Cited by 13 publications
(21 citation statements)
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“…This method enhances the capillary pumping of microstructures [12]. Lin et al [13] presented a novel groove microstructure. Through experiments, the heat transfer coefficient at the condenser of this composite structure was discovered to be 120% higher than that of the traditional groove structure.…”
Section: Open Accessmentioning
confidence: 99%
“…This method enhances the capillary pumping of microstructures [12]. Lin et al [13] presented a novel groove microstructure. Through experiments, the heat transfer coefficient at the condenser of this composite structure was discovered to be 120% higher than that of the traditional groove structure.…”
Section: Open Accessmentioning
confidence: 99%
“…The most widely used cooling method for electronics to date has been forced air convection, but this method is unable to keep up with the increasing level of heat flux due to the necessary increase in size of the metal fin-array heat sinks. A schematic of a typical fin-array heat sink is shown in Figure 1 Given the limitations of conventional forced air convection cooling, various solutions have been proposed including thermoelectric cooling [4][5][6], miniature heat pipes [7,8], microchannel heat sinks [9][10][11], and two-phase boiling [12][13][14].…”
Section: Electronics Coolingmentioning
confidence: 99%
“…To overcome this size limitation, microchannels instead of wire-meshes are more often adopted as the wick structure for miniature or micro-heat pipes in which the capillary flow of a working fluid occurs along the microchannels. Since the report of a microchannel-based MHP by Cotter [3] in 1984, there have been many experimental and theoretical studies for the MHPs configured with different types of microgrooves [4][5][6][7][8][9].…”
Section: Introductionmentioning
confidence: 99%