High-Performance MEMS Pressure Sensor Fully-Integrated with a 3-Axis Accelerometer

Souchon, Frédéric; Joet, Loic; Ladner, Carine; Rey, Patrice; Louwers, Stephan

doi:10.1109/sensors43011.2019.8956512

Cited by 6 publications

(11 citation statements)

References 9 publications

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“…The design was subsequently altered to incorporate a 3‐axis accelerometer via monolithic integration. [ 71 ] The resulting device exhibited an improved sensitivity of 57.3 μV V −1 kPa −1 with a similar nonlinearity. The temperature sensitivity of the device was further reduced to 0.06% within −35 to 145 °C.…”

Section: Applications and Devicesmentioning

confidence: 95%

“…[80] The proposed in-plane accelerometer design incorporated a differential measurement principle, and its fabrication technique was also equally compatible with the out-ofplane accelerometer. [71] Furthermore, various strategies for improving the bandwidth and damping performance of the The SEM image provides a close-up with nanoresonators, R, connected to a differential pair of Si NW gages, G, on both sides of the proof mass, M. Sensor response in terms of resonance frequency change of nanoresonators detected through the piezoresistive Si NW gages is provided in the plot. Reproduced with permission.…”

Section: Accelerometersmentioning

confidence: 99%

“…The applications of this technology to a variety of sensors were reported ranging from inertial measurement devices to pressure sensors. [ 71–73 ]…”

Section: Fabrication Techniquesmentioning

confidence: 99%

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Silicon Nanowires Driving Miniaturization of Microelectromechanical Systems Physical Sensors: A Review

et al. 2023

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The miniaturization of microelectromechanical systems (MEMS) physical sensors is driven by global connectivity needs and is closely linked to emerging digital technologies and the Internet of Things. Strong technical advantages of miniaturization such as improved sensitivity, functionality, and power consumption are accompanied by significant economic benefits due to semiconductor manufacturing. Hence, the trend to produce smaller sensors and their driving force resemble very much those of the miniaturization of integrated circuits (ICs) as described by Moore's law. In this respect, with its IC‐, and MEMS‐compatibility, and scalability, the silicon nanowire is frequently employed in frontier research as the sensor building block replacing conventional sensors. The integration of the silicon nanowire with MEMS has thus generated a multiscale hybrid architecture, where the silicon nanowire serves as the piezoresistive transducer and MEMS provide an interface with external forces, such as inertial or magnetic. This approach has been reported for almost all physical sensor types over the last decade. These sensors are reviewed here with detailed classification. In each case, associated technological challenges and comparisons with conventional counterparts are provided. Future directions and opportunities are highlighted.

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Section: Applications and Devicesmentioning

confidence: 95%

Section: Accelerometersmentioning

confidence: 99%

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Silicon Nanowires Driving Miniaturization of Microelectromechanical Systems Physical Sensors: A Review

et al. 2023

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“…Although most nanosensors are used for mass detection, 23–25 there is also considerable interest in force or pressure sensing. Their small size is essential for applications requiring high spatial resolution of pressure measurements, 26 permits integration with other sensors, 27 and shows reduced power consumption 28 . Their increased sensitivity allows nanoplates to detect forces of small magnitude such as Van der Waals, chemical bonding or Casimir forces, 29 or subtle pressures changes for acoustic location 30 .…”

Section: Introductionmentioning

confidence: 99%

Inverse load identification in vibrating nanoplates

Kawano

Morassi

Zaera

2022

Math Methods in App Sciences

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In this paper, we consider the uniqueness issue for the inverse problem of load identification in a nanoplate by dynamic measurements. Working in the framework of the strain gradient linear elasticity theory, we first deduce a Kirchhoff-Love nanoplate model, and we analyze the well-posedness of the equilibrium problem, clarifying the correct Neumann conditions on curved portions of the boundary. Our uniqueness result states that, given a transverse dynamic load ∑ M m=1 g m (t)𝑓 m (x), where M ≥ 1 and {g m (t)} M m=1 are known time-dependent functions, if the transverse displacement of the nanoplate is known in an open subset of its domain for any interval of time, then the spatial components {𝑓 m (x)} M m=1 can be determined uniquely from the data. The proof is based on the spherical means method. The uniqueness result suggests a reconstruction technique to approximate the loads, as confirmed by a series of numerical simulations performed on a rectangular clamped nanoplate.

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“…In this context, we wanted to evaluate an existing silicon only technology for use at temperatures up to 600°C. During the last years, MEMS pressure sensors based on the M&NEMS technological platform were developed for commercial [6] and automotive applications [7]. These devices use piezoresistive suspended silicon nanogauges as the sensing element.…”

Section: Introductionmentioning

confidence: 99%