2012
DOI: 10.1016/j.mseb.2011.10.013
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High performance infra-red detectors based on Si/SiGe multilayers quantum structure

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Cited by 7 publications
(6 citation statements)
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“…Moreover, GeSnSiC alloys are also important for future Si-based monolithic integration [ 156 ]. To further improve the device performance, quantum well structures [ 157 , 158 ] and quantum dots multilayer structures [ 159 ] are also feasible for the enhancement of SWIR detection. For the APD devices, the multiplication effect also plays a vital role in the device’s performance.…”
Section: Swir Apds Focal Plane Arrays (Fpas)mentioning
confidence: 99%
“…Moreover, GeSnSiC alloys are also important for future Si-based monolithic integration [ 156 ]. To further improve the device performance, quantum well structures [ 157 , 158 ] and quantum dots multilayer structures [ 159 ] are also feasible for the enhancement of SWIR detection. For the APD devices, the multiplication effect also plays a vital role in the device’s performance.…”
Section: Swir Apds Focal Plane Arrays (Fpas)mentioning
confidence: 99%
“…This allows classifying optical modulators in two main groups: (i) Electro-refraction modulators and (ii) Electro-absorption modulators, respectively. The most common physical effects exploited for optical modulation in photonics are Thermo-Optic (TO) [114], Pockels [115][116][117], Franz-Keldysh (FK) [118][119], Quantum confined Stark Effect (QCSE) [120][121][122][123][124][125][126][127], and Free-Carrier Plasma Dispersion effects .…”
Section: Ii2 Optical Modulationmentioning
confidence: 99%
“…There are two main EA mechanisms in silicon photonics: the Franz-Keldysh effect and the (QCSE). Both of these effects have been demonstrated in Germanium and Germanium alloys [119][120][121][122][123][124][125][126][127][128], providing a platform for siliconcompatible materials for high speed, low power, and compact modulators.…”
Section: Electro-absorption Effectsmentioning
confidence: 99%
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“…On-chip electronic devices are usually the traditional microelectronic devices, such as MOSFETs, TFETs, FinFETs, etc [ 1 , 2 , 3 , 4 ]. Moreover, photonic devices mainly include lasers [ 5 , 6 , 7 , 8 ], modulators [ 9 , 10 , 11 , 12 ], detectors [ 13 , 14 , 15 , 16 , 17 , 18 , 19 ], waveguides [ 20 , 21 , 22 , 23 ], etc. From the practical perspective, the Si-based on-chip light source was regarded as the final technical hurdle to convert the electron signal into an optical signal, which features the most striking and indispensable unit to achieve high performance Si-based OEICs [ 24 , 25 , 26 , 27 ].…”
Section: Introductionmentioning
confidence: 99%