2019 Symposium on VLSI Technology 2019
DOI: 10.23919/vlsit.2019.8776543
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High Performance Heterogeneous Integration on Fan-out RDL Interposer

Shuo-Mao Chen
1
,
Ming-Chih Yew
2
,
Feng-Cheng Hsu
3
et al.
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Cited by 7 publications
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Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers

Chery
1
,
Slabbekoorn
2
,
Pinho
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
13
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4
0
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Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers

Chery
1
,
Slabbekoorn
2
,
Pinho
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
13
0
4
0
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Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer

Kwak
1
,
Chery
2
,
Bertheau
3
et al. 2023
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
1
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Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing

Pinho
1
,
Chery
2
,
Pantano
3
et al. 2023
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
2
0
0
0
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