1981
DOI: 10.1109/edl.1981.25367
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High-performance heat sinking for VLSI

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Cited by 4,171 publications
(1,393 citation statements)
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References 6 publications
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“…Making the tradeoff between accuracy and execution time, the grid system 5010145 is finally chosen for the simulation model. It is also found that the present predictions agree well with those of Tuckerman and Pease [21] and Ho et al [22]. Through these tests, the numerical scheme was found to be suitable for the present problem.…”
supporting
confidence: 83%
“…Making the tradeoff between accuracy and execution time, the grid system 5010145 is finally chosen for the simulation model. It is also found that the present predictions agree well with those of Tuckerman and Pease [21] and Ho et al [22]. Through these tests, the numerical scheme was found to be suitable for the present problem.…”
supporting
confidence: 83%
“…This was already realized in 1981 by Tuckerman and Pease in their landmark paper on micro heat exchange. 70 They reported that heat dissipation up to 790 W/cm 2 was possible for a single-phase water-cooling system, which was used for cooling integrated circuits. Since then many different applications of micro heat exchangers have been realized, e.g.…”
Section: Heat Transport Phenomenamentioning
confidence: 99%
“…In the absence of sufficient heat removal, the working temperature of this component may exceed a desired temperature level which then increases the critical failure rate of equipment. Therefore, advanced electronic equipment with high heat generation requires an efficient and compact device to provide proper cooling operation [1]. In order to meet the cooling requirement, needs to increase the product of heat transfer coefficient (h) and heat transfer surface area (A) for a device.…”
Section: Introductionmentioning
confidence: 99%