High-Performance Flip-Chip BGA Technology Based on Thin-Core and Coreless Package Substrate

Koide, Masateru; Fukuzono, Kenji; Sato, Takeru; Abe, K.; Fujisaki, Hidehiko

doi:10.5104/jiep.11.212

Cited by 2 publications

(3 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The selection of TIM-1 and the packaging design to accommodate it are extremely important in the whole thermal management strategy. A new metallic thermal interface technology, for example, using In-10Ag composite as TIM-1, was developed [33] with the objectives of minimizing the interface thermal resistance and the thermal stress on the package components, and meeting the environmental requirements as well. The compound In-10Ag has a composition of 90% indium and 10% silver.…”

Section: Advanced Thermal Interface Materialsmentioning

confidence: 99%

“…A picture of the cross-section of the package is shown in Figure 8, where In-10Ag TIM-1 is seen between the chip and IHS. The BLT and the soldered area are optimized to effectively disperse thermal stresses [33]. Figure 9 shows the interface thermal resistance versus the BLT; the experimental data are compared with the predictions.…”

Section: Advanced Thermal Interface Materialsmentioning

confidence: 99%

See 1 more Smart Citation

Challenges in Cooling Design of CPU Packages for High-Performance Servers

Wei

2008

Heat Transfer Engineering

View full text Add to dashboard Cite

Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed from a viewpoint of industrial application. Particular attention is directed to heat conduction in the package and heat removal from the package/heat sink module. Power dissipation and package cooling characteristics of high-performance microprocessors are analyzed. The development of a new metallic thermal interface technology is introduced, where thermal and mechanical performance of an indium-silver alloy in the chip/heat spreader assembly was studied. The paper also reports on research on other thermal management materials, such as diamond composite heat-spreading materials. Some actual package designs are described to illustrate the enhanced heat spreading capability of heat pipes and vapor chambers.

show abstract

Section: Advanced Thermal Interface Materialsmentioning

confidence: 99%

Section: Advanced Thermal Interface Materialsmentioning

confidence: 99%

Challenges in Cooling Design of CPU Packages for High-Performance Servers

Wei

2008

Heat Transfer Engineering

View full text Add to dashboard Cite

show abstract

“…If the bump was made of solder and metals (Cu or Au), it was called "C2" (chip connection). C4 and C2 were developed in the 1990s, and from a morphological viewpoint, a type of FCB was derived from ball grid array (BGA) technology [7,52]. Solder bumps are melted and solidified in the bonding process.…”

Section: Introductionmentioning

confidence: 99%

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Takahashi

Fukuda

Yoneshima

et al. 2017

Journal of Electronic Packaging

View full text Add to dashboard Cite

Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects but has common bonding mechanisms regarding friction slip, plastic deformation, and friction heating. In the present paper, solid-state microjoining mechanisms in Au wire (ball) bonding, FCB, Al wire bonding (WB), and Al ribbon bonding are discussed to systematically understand the common bonding mechanisms. Ultrasonic vibration enhances friction slip and plastic deformation, making it possible to rapidly obtain dry interconnects. Metallic adhesion at the central area of the bonding interface is mainly produced by the friction slip. On the other hand, the folding of the lateral side surfaces of the Au bump, Au ball, and Al wire is very important for increasing the bonded area. The central and peripheral adhesions are achieved by a slip-and-fold mechanism. The solid-state microjoining mechanisms of WB and FCB are discussed based on experimental results.

show abstract

High-Performance Flip-Chip BGA Technology Based on Thin-Core and Coreless Package Substrate

Cited by 2 publications

References 0 publications

Challenges in Cooling Design of CPU Packages for High-Performance Servers

Challenges in Cooling Design of CPU Packages for High-Performance Servers

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Contact Info

Product

Resources

About