High-performance bismaleimide resins with low cure temperature for resin transfer molding process

Abstract

High-performance bismaleimide resin systems (here coined LBMI resin series) based on 4,4-bismaleimidodiphenylmethane, 2,4-bismaleimidotoluene, bisphenol A bisallyl ether, 4,4′-bis[2-(1-propenyl)phenoxy]benzophenone, 2-allylphenol, and cumene hydroperoxide for resin transfer molding (RTM) process with low cure and post-cure temperatures (≦180°C) have been developed. Considering the optimum formulation conditions, the injection temperature is in the range of 70–160°C, and the pot life at 100°C is determined to be approximately 100 min. After curing at 180°C for 6 h, the resins exhibit high thermal resistances, excellent mechanical properties, and exceptionally low dielectric loss. Among others, these findings render the materials suitable for the use as high-performance resins for the production of advanced composites via RTM technique and with low cure temperatures.

A facile approach to prepare cage‐ladder‐structure phosphorus‐containing amino‐functionalized POSS for enhancing flame retardancy of epoxy resins

“…With the low loadings, good solubility of CLEP‐DOPO‐POSS in EP, the FR has potential applications in fabricating advanced composites via resin transfer molding (RTM) process. Generally, RTM process involves the injection of a low viscosity pre‐catalyzed thermosetting resin, into a mold cavity containing a pre‐placed fiber preform and subsequent curing of the resin to form a composite part 40 . If the loadings of FR are high, the viscosity of resin would increase too high for the RTM process, if the FRs are not soluble in the resin matrix, the FRs would be filtered by the fiber preform during the injection.…”

Thioetherimide-Modified Cyanate Ester Resin with Better Molding Performance for Glass Fiber Reinforced Composites

“…Therefore, novel polymers or polymer composites with higher heat resistance, lower coefficients of thermal expansion (CTE), lower water absorption ratios, and superior dielectric properties are highly required in the PCB industry. Cyanate esters (CEs) are popular thermoset polymeric materials with good processability, excellent moisture and heat resistance, high dimensional stability, good dielectric properties, and much lower cost compared to polyimide resins, which have been widely used in the production of high-frequency PCBs and radar domes [1,2,3,4,5,6]. Although CE resins have excellent comprehensive properties compared to those of epoxy resins, a brittle cured product or a fracture strain of less than 2% can make a CE resin fail to meet many applications, due to its high cross-link density after polymerization.…”

Star‐shaped silicon‐containing arylacetylene resin based on a one‐pot synthesis using zinc powder catalysis with improved processing and thermal properties

“…Thermosetting resins used for composite structures require specific properties if they are to succeed as matrix materials in high‐performance applications. To be used widely in high‐tech applications, a resin must be thermoxidatively stable under the operating temperatures to limit the evolution of volatile compounds, while also possessing good processability for practical application and production (e.g., resin transfer molding [RTM] or winding process) …”