High Performance and Flexible Electrodeposited Silver Mesh Transparent Conducting Electrodes Based on a Self-Cracking Template

Flexible Embedded Metal Meshes by Sputter-Free Crack Lithography for Transparent Electrodes and Electromagnetic Interference Shielding

“…Electroplating and electrodeposition methods have been used to increase the thickness of metal meshes after the crack template lift-off, but these methods have their limitations as metal tends to deposit isotropically, which can lead to an undesirable increase in mesh width. 74 Figure 6a presents the optical transmission results of our Ag mesh samples across the visible spectrum, ranging from 400 to 800 nm wavelength. The transmission values were adjusted to exclude the influence of the substrate.…”

“…Despite these increases in sheet resistance, the impact on the EMI SE was not significantly pronounced (Figure 7b). After the bending tests, the average SE for samples 1 through 5 changed The following works in the literature are shown: Cu mesh(Liu), 67 Ag mesh (Cui), 68 graphene/Ni mesh, 32 Ti/Ag meshes, 73 Ag mesh (Han), 69 Ag mesh (Rao and Gupta), 76 Ag mesh (Xian), 71 Ag mesh (Gupta), 79 Ag mesh (Rao and Hunger), 80 Au mesh (Guo), 81 Ag mesh (Kang), 74 Au mesh (Muzzillo), 70 and Ag mesh (Voronin). from 42.5 to 41.4, from 42.0 to 39.5, from 37.4 to 35.6, from 39.7 to 37.6, and from 38.3 to 38.1 dB, respectively.…”

“…(a) Transmission at 550 nm versus sheet resistance and (b) σ DC /σ OP versus sheet resistance. The following works in the literature are shown: Cu mesh­(Liu), Ag mesh (Cui), graphene/Ni mesh, Ti/Ag meshes, Ag mesh (Han), Ag mesh (Rao and Gupta), Ag mesh (Xian), Ag mesh (Gupta), Ag mesh (Rao and Hunger), Au mesh (Guo), Ag mesh (Kang), Au mesh (Muzzillo), and Ag mesh (Voronin) …”

“…Additionally, conductive metals such as silver (Ag) and copper (Cu) tend to adhere poorly to substrate surfaces, which typically necessitates the use of a costly titanium adhesive layer . An alternative to sputtering is electrodeposition of the metallic films. , However, this method requires either a seed layer or a conductive substrate (commonly ITO/glass) . Using a rigid, conductive substrate can impede the application of the formed metals for flexible optoelectronics.…”

“…Transparent electrode performance of PET-embedded Ag meshes for our five samples compared to that of other crack lithography metal meshes in the literature. (a) Transmission at 550 nm versus sheet resistance and (b) σ DC /σ OP versus sheet resistance.The following works in the literature are shown: Cu mesh(Liu),67 Ag mesh (Cui),68 graphene/Ni mesh,32 Ti/Ag meshes,73 Ag mesh (Han),69 Ag mesh (Rao and Gupta),76 Ag mesh (Xian),71 Ag mesh (Gupta),79 Ag mesh (Rao and Hunger),80 Au mesh (Guo),81 Ag mesh (Kang),74 Au mesh (Muzzillo),70 and Ag mesh(Voronin) 58.…”