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Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)
DOI: 10.1109/memsys.2001.906465
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High performance accelerometer based on CMOS technologies with low cost add-ons

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Cited by 10 publications
(7 citation statements)
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“…Mechanical part consists of a proof mass suspended by springs [6] (Figure 2) and can be described by (1), where mass of the sensor is m, (00 = �( k/ m ) is a resonance frequency dependent on m and the spring constant k, while t5 is a damping factor defined by friction of the media This work has been partly supported by center of excellence NAMASTE.…”
Section: Theorymentioning
confidence: 99%
See 1 more Smart Citation
“…Mechanical part consists of a proof mass suspended by springs [6] (Figure 2) and can be described by (1), where mass of the sensor is m, (00 = �( k/ m ) is a resonance frequency dependent on m and the spring constant k, while t5 is a damping factor defined by friction of the media This work has been partly supported by center of excellence NAMASTE.…”
Section: Theorymentioning
confidence: 99%
“…The linear term in (5) is much smaller than w; , so the right summand could be neglected, which gives (6). Because linear model described by (6) does not contain any term in dz we can drop the line connecting that signal with block F fb (Figure 1). …”
Section: (4)mentioning
confidence: 99%
“…Relaxation oscillators using the sensing capacitor as frequencydetermining element have also been developed [17]. The most popular approach to read-out capacitive sensors with high resolution and good suppression of parasitics is switched capacitor design [18][19][20][21][22]. Table 1.2.2 compares the performances of the different designs.…”
Section: Read-out Circuitrymentioning
confidence: 99%
“…Even though the fabrication process does not require any micromachining steps, the gold electrodes and chip passivation required for biocompatibility are deposited on top of the completed CMOS substrate. Another recent CMOS MEMS approach demonstrated by austriamicrosystems combines a sensor wafer with a CMOS substrate wafer: a capacitive acceleration sensor is fabricated by waferbonding the sensor wafer with polysilicon sensor structures on to a CMOS substrate wafer with sensing electrode and read-out electronics [17].…”
Section: Technology Overviewmentioning
confidence: 99%
“…• Exploitation of laboratory CMOS MEMS by systematic process development for industrial mass production [17].…”
Section: Cmos Mems Based Productsmentioning
confidence: 99%