“…Mechanical part consists of a proof mass suspended by springs [6] (Figure 2) and can be described by (1), where mass of the sensor is m, (00 = �( k/ m ) is a resonance frequency dependent on m and the spring constant k, while t5 is a damping factor defined by friction of the media This work has been partly supported by center of excellence NAMASTE.…”
Section: Theorymentioning
confidence: 99%
“…The linear term in (5) is much smaller than w; , so the right summand could be neglected, which gives (6). Because linear model described by (6) does not contain any term in dz we can drop the line connecting that signal with block F fb (Figure 1). …”
In this article we present part of the design methodology, modeling and efficient simulation of high performance micro-electromechanical 1:,1 modulator used for MEMS accelerometer. The method is based on converting continuous-time model of the MEMS sensor and eventual analog loop filter into discrete time equivalent using impulse invariant transformation. The methodology is valid for any "MEMS based cantilever" sensor operating in a closed loop, where mechanical transfer function does not provide adequate noise shaping to reach high accuracy and resolution. Using proposed methodology makes possible to efficiently design, predict the behavior and stability of the loop and perform efficient system level simulations.
“…Mechanical part consists of a proof mass suspended by springs [6] (Figure 2) and can be described by (1), where mass of the sensor is m, (00 = �( k/ m ) is a resonance frequency dependent on m and the spring constant k, while t5 is a damping factor defined by friction of the media This work has been partly supported by center of excellence NAMASTE.…”
Section: Theorymentioning
confidence: 99%
“…The linear term in (5) is much smaller than w; , so the right summand could be neglected, which gives (6). Because linear model described by (6) does not contain any term in dz we can drop the line connecting that signal with block F fb (Figure 1). …”
In this article we present part of the design methodology, modeling and efficient simulation of high performance micro-electromechanical 1:,1 modulator used for MEMS accelerometer. The method is based on converting continuous-time model of the MEMS sensor and eventual analog loop filter into discrete time equivalent using impulse invariant transformation. The methodology is valid for any "MEMS based cantilever" sensor operating in a closed loop, where mechanical transfer function does not provide adequate noise shaping to reach high accuracy and resolution. Using proposed methodology makes possible to efficiently design, predict the behavior and stability of the loop and perform efficient system level simulations.
“…Relaxation oscillators using the sensing capacitor as frequencydetermining element have also been developed [17]. The most popular approach to read-out capacitive sensors with high resolution and good suppression of parasitics is switched capacitor design [18][19][20][21][22]. Table 1.2.2 compares the performances of the different designs.…”
Sensor arrays based on industrial CMOS-technology combined with post-CMOS micromachining (CMOS MEMS) are a promising approach to low-cost sensors. In the first part of this article [1], the state of research on CMOS-based gas sensor systems was reviewed, and a platform technology for monolithic integration of three different transducers on a single chip was described. In this second part, the transduction principles of three polymer-based gas sensors are detailed and the read-out circuitry is portrayed. The first transducer is a micromachined resonant cantilever. The absorption of analyte in the chemically sensitive polymer causes shifts in resonance frequency as a consequence of changes in the oscillating mass. The cantilever acts as the frequency-determining element in an oscillator circuit, and the resulting frequency change is read out by an on-chip counter. The second transducer is a planar capacitor with polymer-coated interdigitated electrodes. This transducer monitors changes in the dielectric constant upon absorption of the analyte into the polymer matrix. The sensor response is read out as a differential signal between the coated sensing capacitor and a passivated reference capacitor, both of which are incorporated into the input stage of a switched capacitor second-order RD-modulator. The third transducer is a thermoelectric calorimeter, which detects enthalpy changes upon ab-/desorption of analyte molecules into a polymer film located on a thermally insulated membrane. The enthalpy changes in the polymer film cause transient temperature variations, which are detected via polysilicon/aluminum thermocouples (Seebeck effect). The small signals in the lVrange are first amplified with a low-noise chopper amplifier, then converted to a digital signal using a RD-A/D-converter and finally decimated and filtered with a digital decimation filter.
“…Even though the fabrication process does not require any micromachining steps, the gold electrodes and chip passivation required for biocompatibility are deposited on top of the completed CMOS substrate. Another recent CMOS MEMS approach demonstrated by austriamicrosystems combines a sensor wafer with a CMOS substrate wafer: a capacitive acceleration sensor is fabricated by waferbonding the sensor wafer with polysilicon sensor structures on to a CMOS substrate wafer with sensing electrode and read-out electronics [17].…”
Section: Technology Overviewmentioning
confidence: 99%
“…• Exploitation of laboratory CMOS MEMS by systematic process development for industrial mass production [17].…”
The paper reviews the state-of-the-art in the field of CMOS-based microelectromechanical systems (MEMS). The different CMOS MEMS fabrication approaches, pre-CMOS, intermediate-CMOS, and post-CMOS, are summarized and examples are given. Two microsystems fabricated with post-CMOS micromachining are presented, namely a mass-sensitive chemical sensor for detection of organic volatiles in air and a 10-cantilever force sensor array for application in scanning probe microscopy. The paper finishes with a look into the future, discussing key challenges and future application fields for CMOS MEMS.
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