IntroductionThis paper presents a highly integrated WiMAX System-in-Package (SiP) based on LTCC technology (Low Temperature Co-fired Ceramics). It comprises the complete passive and active RF frontend plus the transceiver RFIC for up-and down-conversion to base band. The overall size of such a smart package strongly depends on the applied technology and level of integration (multiband/multimode). The benefits on size reduction coming from advanced integration and assembly technologies are discussed and a very compact LTCC SiP with less than 50 mm 2 size and SMT-compatible footprint is demonstrated. Top level measurements show full performance and thus fully validate the LTCC integration approach.
Motivation