High packing linear integrated circuits using planar metallization with polymer

Abstract

A l i n e a r I C f o r the TV chroma systems has been packed an a 2.34x2.36d chip using a two-level interconnection with p l a n a r Metallization with p o l y m e r (pw) technology,

Polarization Effects in Polyimides

“…Such a mechanism may have been responsible for the changes in polarization behavior which occurred in the thin polyimide films studied. Planar magnetron-sputtered SiO2 films have been found to be desirable as insulating materials in integrated circuits, such as aluminum multilevel interconnections, because of their high deposition rates, very low deposition temperature, and good step coverage (1). Some studies on deposition.rates and step coverage, as well as on applications for device fabrication, of such planar magnetron-sputtered SiO2 films have been reported (2)(3)(4)(5).…”

“…Polyimide is a class of high temperature, stable organic polymers that has found widespread use in the semiconductor industry. It has been used as an interlevel dielectric in multilevel discrete transistors (1), and as a final passivant (2). More recently, its role in silicon and aluminum MOS integrated circuits has been demonstrated (3).…”