High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives

Menon, Sandeep; George, Elviz; Osterman, Michael; Pecht, Michael

doi:10.1007/s10854-015-2940-4

Cited by 67 publications

(23 citation statements)

References 23 publications

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“…Although the restriction of hazardous substances (RoHS) effectively bans the use of Pb in electrical products, there is still exemption for some special Sn-Pb solders such as high-Pb solders (contain 85% by weight or more Pb) which are broadly used in automotive, space, oil and gas, and avionics industries. 127,128 So the ECM of Sn-Pb solder alloys still deserves further study.…”

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confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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“…In high temperature applications the most common solder alloys are Pb-Sn alloys containing 85-97 %Pb because of several favorable characteristics such as proper melting temperature range (300-314°C), low cost, excellent wettability, and workability [1,2]. However, global concerns over the environmental impacts and human health issues due to toxicity of Pb bearing solder alloys remained as a major issue [3].…”

Section: Introductionmentioning

confidence: 99%

Study of off-eutectic Zn–xMg high temperature solder alloys

Galib

Hasan

Sharif

2016

J Mater Sci: Mater Electron

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Researchers have been working for some times to develop a Pb-free substitute for high-Pb containing solders in electronics. In this study the effect of Mg content on microstructure, melting behavior, thermal, electrical and mechanical properties of a new high-temperature Pb-free solder based on binary Zn-Mg alloy were investigated. The nominal compositions of Zn-xMg (x = 0.5-6.0) alloys were synthesized by conventional melting and casting route. The microstructures of the solders changed significantly on adding Mg content. Higher Mg containing alloys were found rich in intermetallic phases. The formation of the Mg 2 Zn 11 and metastable MgZn 2 intermetallic phases were identified and were also quantified by X-ray diffraction analysis. The presence of higher amount of intermetallic compounds in hypereutectic Zn-Mg systems deteriorated the tensile properties of the binary alloy. The results of electrical resistivity test indicated that the Mg could elevate the resistivity of newly developed Zn-Mg alloys. The melting behavior of the solder alloys studied by differential thermal analysis (DTA) analysis revealed that the melting temperature range of the solder alloys narrowed with Mg addition. Thermal mechanical analysis (TMA) analysis revealed that the co-efficient of thermal expansion (CTE) decreased on increasing Mg content.

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“…High-lead solders (Pb content: 85-97 wt.%) are commonly applied in high-temperature electronics (HTE), including devices for use in aircraft, automotive, space and drilling applications [1,2]. However, due to health and environmental concerns, the development of high-temperature lead-free solders to replace lead solders is of vital importance.…”

Section: Introductionmentioning

confidence: 99%

Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

Liu

Chen

Zhou

et al. 2017

Journal of Alloys and Compounds

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The operating temperature of high-temperature electronics can significantly promote the growth of intermetallic compounds (IMCs) at solder/substrate interfaces, particularly for low-cost Zn-based solders because of the rapid rate of reaction of Zn with Cu. Thus, a reliable and robust diffusion barrier is indispensable for suppressing the reactions between solder and substrate. In this work, a ternary Ni-W-P alloy was prepared via electroless plating. Its diffusion barrier property was evaluated by comparing the microstructures of IMC layers in Zn-5Al/Ni-W-P/Cu and Zn-5Al/Cu interconnects after liquid-solid reaction for prolonged durations. When the reaction lasted for 30 min, the thickness of the Al 3 Ni 2 produced in the Zn-5Al/Ni-W-P/Cu solder interconnects was only 2.15 μm, whereas the thickness of the interfacial layer of Cu-Zn IMCs (CuZn 4 , Cu 5 Zn 8 and CuZn) at the Zn-5Al/Cu interface was 94 μm. Because of the unbalanced growth of the IMCs in the Zn-5Al/ Cu interconnects, notable numbers of Kirkendall voids were identified at the CuZn 4 /Cu 5 Zn 8 , Cu 5 Zn 8 /CuZn and CuZn/Cu interfaces after prolonged liquid-solid reaction. By contrast, the Al 3 Ni 2 layer in the Zn-5Al/ Ni-W-P/Cu solder joints remained intact, showing the potential to effectively enhance the mechanical reliability of electronic devices.

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High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives

Cited by 67 publications

References 23 publications

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration of Sn and Sn solder alloys: a review

Study of off-eutectic Zn–xMg high temperature solder alloys

Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

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