2007
DOI: 10.1016/j.apsusc.2007.02.166
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High-k dielectric oxides obtained by PLD as solution for gates dielectric in MOS devices

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Cited by 39 publications
(26 citation statements)
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“…ZrO 2 is an important material, which possesses interesting properties such as large resistance against oxidation, high melting point (2,715 ∘ C), excellent thermal stability, and good ionic conductivity in the Y-stabilized cubic phase. For example, ZrO2 thin film is a promising candidate to replace silicon dioxide as the gate dielectric in complementary metal-oxidesemiconductor technology [5][6][7][8][9][10][11][12][13][14][15]. It is an electrical insulating material with a band gap of 5 eV and has potential use as an alternative material for storage capacitors in dynamic random access memories.…”
Section: Introductionmentioning
confidence: 99%
“…ZrO 2 is an important material, which possesses interesting properties such as large resistance against oxidation, high melting point (2,715 ∘ C), excellent thermal stability, and good ionic conductivity in the Y-stabilized cubic phase. For example, ZrO2 thin film is a promising candidate to replace silicon dioxide as the gate dielectric in complementary metal-oxidesemiconductor technology [5][6][7][8][9][10][11][12][13][14][15]. It is an electrical insulating material with a band gap of 5 eV and has potential use as an alternative material for storage capacitors in dynamic random access memories.…”
Section: Introductionmentioning
confidence: 99%
“…3 In addition, ZrO2 thin films have been considered to replace SiO2 due to their high k dielectric property in the metal-oxide-semiconductor transistor. 4 These applications have led to various techniques to synthesize zirconium oxide thin films including direct current reactive magnetron sputtering, 5,6 chemical vapor deposition, 7,8 sol-gel techniques, 2,9 pulsed ion beam evaporation, 10 liquid phase deposition, 11 and filtered cathodic vacuum arc. 12 Radio frequency (RF) reactive magnetron sputtering is a widely used technique which is affected by several deposition conditions, such as the RF power, mixing ratio of plasma gas, and substrate temperature etc.…”
Section: Introductionmentioning
confidence: 99%
“…The studies related to design and characterization of the MOS devices have been performed to its better performance since the last few decades [4][5][6]. Due to several possible sources of errors, the electrical characteristics of MOS capacitors deviate from expected ideal behavior.…”
Section: Introductionmentioning
confidence: 99%