High-Intensity Light-Emitting Diode and Reduced Curing Times—An In Vitro Study

Abstract

Objective: To evaluate and compare the effect of high-intensity light-emitting diode (LED) light-curing unit at different curing times on the shear bond strength (SBS), surface enamel loss, and degree of polymerization of a light-cure and dual-cure adhesive system. Materials and Methods: One hundred and twenty extracted human premolar teeth were divided into 2 groups— group 1 (light cure) and group 2 (dual cure), depending on the adhesive system used. These groups were further subdivided into 3 subgroups with 20 teeth each, depending on the duration of curing. A high-intensity LED curing unit was used to bond metal brackets onto the teeth. The samples were tested on a universal testing machine to measure the SBS. The samples were then observed under a simple microscope and modified adhesive remnant index scores were assigned. The bracket bases were mapped with energy-dispersive X-ray spectrometry to evaluate the amount of enamel present. Cured adhesive was scraped and was subjected to Fourier-Transform Infrared Spectroscopy to assess the degree of cure (%DC). Results: An increase in curing durations increased mean SBS values, %DC, and calcium-phosphorous ratios (Ca:P). Similarly, these parameters were higher for dual-cure subgroups when compared to light-cure subgroups. Conclusion: High-intensity LEDs can be used successfully for bonding orthodontic brackets with reduced curing duration. These LEDs help to reduce chairside time and can minimize damage to enamel without compromising bond strength.