High-<i>κ</i> polymers of intrinsic microporosity: a new class of high temperature and low loss dielectrics for printed electronics

Zhang, Zhongbo; Zheng, Jifu; Premasiri, Kasun; Kwok, M. W.; Li, Qiong; Li, Ruipeng; Zhang, Suobo; Litt, Morton H.; Gao, Xuan; Zhu, Lei

doi:10.1039/c9mh01261c

Cited by 92 publications

(86 citation statements)

References 43 publications

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“…The high temperature operation of dielectric polymers is limited by a fundamental issue that the thermally and electrically assisted charge injection, excitation and transport can lead to exponential increase of leakage current, and hence low discharged energy density ( U e ) and poor discharge efficiency ( η , defined as the ratio of discharged to stored energy densities) 6 – 8 . Therefore, despite the numerous synthetic and modification approaches to high-temperature dielectric polymers 9 – 13 , appreciable U e (>2.0 J cm −3 ) remains accessible only below 150 °C and is usually accompanied with low η that would cause massive waste heat (Joule heating) and even thermal runaway of the device 14 .…”

Section: Introductionmentioning

confidence: 99%

Polymer/molecular semiconductor all-organic composites for high-temperature dielectric energy storage

et al. 2020

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Dielectric polymers for electrostatic energy storage suffer from low energy density and poor efficiency at elevated temperatures, which constrains their use in the harsh-environment electronic devices, circuits, and systems. Although incorporating insulating, inorganic nanostructures into dielectric polymers promotes the temperature capability, scalable fabrication of high-quality nanocomposite films remains a formidable challenge. Here, we report an all-organic composite comprising dielectric polymers blended with high-electron-affinity molecular semiconductors that exhibits concurrent high energy density (3.0 J cm −3) and high discharge efficiency (90%) up to 200°C, far outperforming the existing dielectric polymers and polymer nanocomposites. We demonstrate that molecular semiconductors immobilize free electrons via strong electrostatic attraction and impede electric charge injection and transport in dielectric polymers, which leads to the substantial performance improvements. The all-organic composites can be fabricated into large-area and high-quality films with uniform dielectric and capacitive performance, which is crucially important for their successful commercialization and practical application in high-temperature electronics and energy storage devices.

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Section: Introductionmentioning

confidence: 99%

Polymer/molecular semiconductor all-organic composites for high-temperature dielectric energy storage

et al. 2020

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“…More recently, improved high-temperature dielectric performance has been demonstrated in a class of dipolar glass polymers based on sulfonylated poly(2,6-dimethyl-1,4phenylene oxide) (SO 2 -PPO) and polymers of intrinsic microporosity (SO 2 -PIM). 26,27 Until now, the introduction of wide bandgap inorganic materials such as boron nitride nanosheets (BNNSs) into polymers to form the polymer composites has been the most effective approach to controlling electrical conduction and achieving high η for elevatedtemperature capacitive energy storage. 17,28 Here we present all-polymer high-temperature capacitive materials based on the crosslinked polymers, which exhibit superior electric discharging performance to the current dielectric polymers at high temperatures.…”

Section: Introductionmentioning

confidence: 99%

Crosslinked fluoropolymers exhibiting superior high-temperature energy density and charge–discharge efficiency

Gadinski

Huang

et al. 2020

Energy Environ. Sci.

199

215

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The electrification of transport requires dielectric materials capable of operating efficiently at high temperatures to meet the increasing demand of electrical energy storage at extreme conditions. Current high-temperature dielectric polymers rely on the incorporation of wide bandgap inorganic fillers to restrain electrical conduction and achieve high efficiencies at elevated temperatures. Here, we report a new class of all-polymer based high-temperature dielectric materials prepared from crosslinking of melt-processable fluoropolymers. The crosslinked polymers exhibit larger discharged energy densities and greater charge-discharge efficiencies along with excellent breakdown strength and cyclic stability at elevated temperatures when compared to the current dielectric polymers. The origins of the marked improvement in the hightemperature capacitive performance are traced to efficient charge-trapping by a range of the molecular trapping centers resulted from the crosslinked structures. In addition, the implementation of melt-extrudable polymers would enable scalable processing that is compatible with the current fabrication techniques used for polymer dielectrics, which is in sharp contrast to the dielectric polymer composites with inorganic fillers.

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“…However, it is still critically needed to consider the thermal stability of the polymer matrix itself, so as to adapt to elevated-temperature and extreme-condition applications. It is thus challenging and of great engineering significance to explore and develop novel polymer matrices with a higher T g and T m [64][65][66][67][68][69][70][71][72].…”

Section: Beyond Energy Density: Thermal Stabilitymentioning

confidence: 99%

Recent progress in polymer dielectrics containing boron nitride nanosheets for high energy density capacitors

Ren

Zhou

et al. 2020

High Voltage

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Hexagonal boron nitride nanosheets (BNNSs) are two‐dimensional nanomaterials with graphitic‐like layered nanostructures, high surface areas, and large aspect ratios. Owing to their excellent thermal conductivity, electrical and mechanical strengths, BNNSs are emerging as multifunctional fillers in polymer dielectrics. In this article, the authors review the recent progress in the BN‐containing polymer nanocomposites designed for high‐performance film capacitors. While general synthetic approaches to BNNSs and polymer/BNNS nanocomposites are summarized, particular attention is placed on structure‐property correlation and rational structural design of the composites with optimized dielectric properties and capacitive performances. In stark contrast to the polymer composites employing high dielectric constant fillers to enhance the electric displacement, a new design concept based on the utilization of BNNSs with a wide bandgap to impede electrical conduction and consequently improve breakdown strength and charge‐discharge efficiency of the polymer composites, is highlighted. The significance of developing dielectric capacitors with desirable thermal conductivity and thermal stability to ensure their robust and efficient operation is emphasized. The merits and challenges regarding the existing polymer dielectrics containing BNNSs for energy storage are identified. An outlook for future research opportunities and engineering applications is also presented in this review.

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High-κ polymers of intrinsic microporosity: a new class of high temperature and low loss dielectrics for printed electronics

Abstract: For the first time, sulfonylated polymers of intrinsic microporosity (PIMs) are exploited for high-κ, high-temperature, and low-loss gate dielectric applications.

Cited by 92 publications

References 43 publications

Polymer/molecular semiconductor all-organic composites for high-temperature dielectric energy storage

Polymer/molecular semiconductor all-organic composites for high-temperature dielectric energy storage

Crosslinked fluoropolymers exhibiting superior high-temperature energy density and charge–discharge efficiency

Recent progress in polymer dielectrics containing boron nitride nanosheets for high energy density capacitors

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