High I/O plastic ball grid array packages-AT&amp;T Microelectronics experience

Cohn, C.E.; Richman, R.M.; Saxena, L.S.; Shih, Ming-Hsiung

doi:10.1109/ectc.1995.514355

Cited by 4 publications

(1 citation statement)

References 3 publications

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“…Furthermore, this heatslug needed to provide a mechanism for efficient thermal coupling to an external heatsink. These thermal management solutions created additional challenges related to die attach materials, heatslug adhesives, and encapsulants as well as their associated assembly processes [ 2 ] . The following areas of concern were given serious consideration related to differences in Thermal Coefficient of Expansion (TCE) of the materials used.…”

Section: A Mechanical Designmentioning

confidence: 99%

Design and development of a high performance PBGA package for the UltraSPARC-I/sup TM/ processor

Abbott

Hamilton²,

Kalidas³

et al.

1996 Proceedings 46th Electronic Components and Technology Conference

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This paper describes the development of a 520 terminal Plastic Ball Grid Array (PBGA) package to meet the system level requirements of the UltraSPARC-ITM microprocessor. The Printed Circuit Board (PCB) substrate PBGA package developed was designed to handle chip operation above 200 MHz and dissipate 36 watts of power with the assistance of an integral heat sink and airflow. Mechanical stresses, board level reliability, thermal and electrical requirements are outlined.The package enhancements and process refinements executed to meet the design goals and reliability requirements are presented.

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Section: A Mechanical Designmentioning

confidence: 99%