High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply

Palko, James W.; Lee, Hyoungsoon; Agonafer, Damena; Zhang, Chi; Jung, Kwonil; Moss, Jess; Wilbur, Joshua D.; Dusseault, Tom J.; Barako, Michael T.; Houshmand, Farzad; Rong, Guoguang; Maitra, Tanmoy; Gorlé, Catherine; Won, Yoonjin; Rockosi, Derrick; Mykyta, Ihor; Resler, Dan; Altman, David; Asheghi, Mehdi; Santiago, Juan G.; Goodson, Kenneth E.

doi:10.1109/itherm.2016.7517728

Cited by 16 publications

(5 citation statements)

References 20 publications

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“…In addition to CHF and HTC, thermal efficiency is often used as a metric to characterize different heat sinks, where liquid pumping power may be important. To evaluate the performance of MHS with comparable two-phase heat sinks using an accepted metric, we plot the maximum cooling capacity of various two-phase flow heat sinks against their required pumping power [11], [30], [51], [56]- [64]. While Fig.…”

Section: Thermal Performance Of Mhsmentioning

confidence: 99%

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Membrane-Based Two Phase Heat Sinks for High Heat Flux Electronics and Lasers

Tamvada

Alipanah

Moghaddam

2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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Thermal management is the current bottleneck in advancement of high-power integrated circuits (ICs), and phase change heat sinks are a promising solution. With a unique structural configuration consisting of a membrane positioned above the heater surface, membrane-based heat sinks (MHS) have thus far attained heat fluxes of up to 2 kW/cm 2 and HTC of up to 1.8 MW/m 2 K using water as the working fluid. This work reports the latest progress and performance evaluation of MHS for high flux thermal management. MHS is implemented in conjunction with a low surface tension liquid to rapidly expel bubbles from the heated surface and reach a CHF of 340 W/cm 2 and a HTC of 120 kW/m 2 K. A parametric comparison shows that thermal efficiency, defined as the ratio of cooling capacity and pumping power consumption, of the prototypical devices exceed values reported hitherto in literature by more than two orders of magnitude. Our results indicate that coupled with surfaces of higher thermal conductivity and membranes of higher permeability, MHS devices could be a promising solution to thermal management needs of high-power electronics and lasers.

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Section: Thermal Performance Of Mhsmentioning

confidence: 99%

“…6. Comparison of thermal performance of MHS devices with existing two-phase flow loops [11], [30], [51], [56]- [64]. The maximum cooling capacity is mapped against the required pumping power for each device.…”

Section: Thermal Performance Of Mhsmentioning

confidence: 99%

Membrane-Based Two Phase Heat Sinks for High Heat Flux Electronics and Lasers

Tamvada

Alipanah

Moghaddam

2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Much experimental work has been conducted in the field of two-phase ultra-high flux cooling. Palko et al [5] utilized a diamond heat sink with laser-micromachined triangular grooves approximately 250 lm wide and 500 lm deep, and coated in a conformal 5 lm copper porous wick structure. Fluid was supplied via a manifold fabricated from polyimide layers designed to vent the vapor flow.…”

Section: Literature Surveymentioning

confidence: 99%

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Mandel

Bae

Ohadi

2018

Journal of Electronic Packaging

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The increasing heat densities in electronic components and focus on energy efficiency have motivated utilization of embedded two-phase cooling, which reduces system-level thermal resistance and pumping power. To achieve maximum benefit, high heat fluxes and vapor qualities should be achieved simultaneously. While many researchers have achieved heat fluxes in excess of 1 kW/cm2, vapor qualities are often below 10%, requiring a significantly large amount of energy spent on subcooling or pumping power, which minimizes the benefit of using two-phase thermal transport. In this work, we describe our recent work with cooling devices utilizing film evaporation with an enhanced fluid delivery system (FEEDS). The design, calibration, and experimental testing of a press-fit and bonded FEEDS test section are detailed here. Heat transfer and pressure drop performance was characterized and discussed. With the press-fit Si test chip, heat fluxes in excess of 1 kW/cm2 were obtained at vapor qualities approaching 45% and a coefficient of performance (COP) approaching 1400. With the bonded SiC test chip, heat fluxes in excess of 1 kW/cm2 were achieved at a vapor quality of 85% and heat densities approaching 490 W/cm3.

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“…Diamond exhibits excellent thermal conductivity (≥2000 W/mK), electrical insulation, high-temperature resistance, and corrosion resistance, thereby efficiently transferring the heat concentrated in devices [ 11 ]. Several reported techniques have been developed using diamonds as a hybrid heat spreader or in combination with microfluidics for thermal management [ 12 , 13 , 14 ]. Among these techniques, bonding closer to the heat junction requires lower thermal interface resistance (TIR) to promote higher 3D heat transfer.…”

Section: Introductionmentioning

confidence: 99%

Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management

Zhao

Wei

et al. 2023

Micromachines

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Three-dimensional integrated packaging with through-silicon vias (TSV) can meet the requirements of high-speed computation, high-density storage, low power consumption, and compactness. However, higher power density increases heat dissipation problems, such as severe internal heat storage and prominent local hot spots. Among bulk materials, diamond has the highest thermal conductivity (≥2000 W/mK), thereby prompting its application in high-power semiconductor devices for heat dissipation. In this paper, we report an innovative bottom-up Cu electroplating technique with a high-aspect-ratio (10:1) through-diamond vias (TDV). The TDV structure was fabricated by laser processing. The electrolyte wettability of the diamond and metallization surface was improved by Ar/O plasma treatment. Finally, a Cu-filled high-aspect-ratio TDV was realized based on the bottom-up Cu electroplating process at a current density of 0.3 ASD. The average single-via resistance was ≤50 mΩ, which demonstrates the promising application of the fabricated TDV in the thermal management of advanced packaging systems.

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High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply

Cited by 16 publications

References 20 publications

Membrane-Based Two Phase Heat Sinks for High Heat Flux Electronics and Lasers

Membrane-Based Two Phase Heat Sinks for High Heat Flux Electronics and Lasers

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management

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