2013
DOI: 10.1109/tpel.2012.2235859
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High-Frequency High Power Density 3-D Integrated Gallium-Nitride-Based Point of Load Module Design

Abstract: The demand for the future power supplies that can achieve higher output currents, smaller sizes, and higher efficiencies cannot be satisfied with the conventional technologies. There are limitations in the switch performance, packaging parasitics, layout parasitics, and thermal management that must be addressed to push for higher frequencies and improved power density. To address these limitations, the utilization of Gallium-Nitride (GaN) transistors, 3-D integrated technique, low-profile magnetic substrates, … Show more

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Cited by 138 publications
(40 citation statements)
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References 12 publications
(12 reference statements)
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“…The active devices are soldered on the one side of the PCB or DBC substrate, and a low profile LTCC inductor is placed on the other side of the substrate. This module can operate at up to 5 MHz [117]. The power density of the 3D integrated POL converter can achieve a power density of as high as 1100 W/in 3 , which is around 10 times higher than that of industry products at the same current level.…”
Section: Power Supply On Chip and Power Supply In Packagementioning
confidence: 99%
“…The active devices are soldered on the one side of the PCB or DBC substrate, and a low profile LTCC inductor is placed on the other side of the substrate. This module can operate at up to 5 MHz [117]. The power density of the 3D integrated POL converter can achieve a power density of as high as 1100 W/in 3 , which is around 10 times higher than that of industry products at the same current level.…”
Section: Power Supply On Chip and Power Supply In Packagementioning
confidence: 99%
“…In this converter, GaN-FETs were utilized as semiconductor switches, which were suitable for high-frequency switching operation. Also, another researches have been proved utilizing GaN-FET for high frequency converter is very practical [2][3][4][5]. Current-mode resonant DC-DC converters are usually controlled by pulse frequency modulation (PFM).…”
Section: Introductionmentioning
confidence: 99%
“…The authors of [9]- [13] studied the application of EPC enhanced mode GaN devices to MHz Buck converters and LLC resonant converters. They also discussed the impact of GaN device layout, magnetic components and distribution parameters on circuits.…”
mentioning
confidence: 99%
“…They also discussed the impact of GaN device layout, magnetic components and distribution parameters on circuits. [13] shows the 3-D Integrated Gallium-Nitride-Based Point of Load Module Design in detail.…”
mentioning
confidence: 99%