High Efficiency Wideband Aperture-Coupled Stacked Patch Antennas Assembled Using Millimeter Thick Micromachined Polymer Structures

Pavuluri, Sumanth Kumar; Wang, Changhai; Sangster, Alan

doi:10.1109/tap.2010.2071334

Cited by 34 publications

(12 citation statements)

References 16 publications

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“…Finally, the use of a printed honeycomb structure allows tailoring of the dielectric constant and significantly improves the dielectric loss. It is well known that air filled dielectrics improve performance as demonstrated by micromachining polymers [20] or using air filled polymer foam like substrates [21]. By utilizing additive inkjet printing to realize a honeycomb structure the material consumption is reduced while providing this performance benefit.…”

Section: Introductionmentioning

confidence: 99%

A Fully Inkjet-Printed 3-D Honeycomb-Inspired Patch Antenna

McKerricher

Titterington²,

Shamim

2016

Antennas Wirel. Propag. Lett.

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Section: Introductionmentioning

confidence: 99%

A Fully Inkjet-Printed 3-D Honeycomb-Inspired Patch Antenna

McKerricher

Titterington²,

Shamim

2016

Antennas Wirel. Propag. Lett.

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“…Thermal bonded SU8 has been investigated for microwave packaging applications [33]. SU8 was also used as ring spacer for polyimide low frequency antenna 2.5-12 GHz [34][35] [36]. In other cases, SU8 pillar metamaterials was utilized for THz imaging [37] and SU8 coated with Cu was employed for coplanar waveguide transmission line at 50GHz [38].…”

Section: Introductionmentioning

confidence: 99%

Investigation of SU8 as a structural material for fabricating passive millimeter-wave and terahertz components

Tian

Shang

Wang

et al. 2015

J. Micro/Nanolith. MEMS MOEMS

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This paper is to provide a systematical review of the technical issues of SU8 fabrication for millimeter-wave and terahertz components based on research works carried out at the University of Birmingham in the past decade. A design-for-manufacturability (DFM) approach is followed. The flexibility of the SU8 process enables many novel device structures. Challenges and problems during the fabrication will be discussed and demonstrated with examples. The measurement of the devices is also a significant challenge when the critical dimensions of the device shrink and special testing fixtures are needed in some cases. Finally, a brief overview of the issues discussed above is given for future guidance.

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“…Micromachining of silicon is a process where semiconductor substrate is mechanically altered, by selectively removing 50-80% from the substrate by etching process. By using bulk micromachining lower effective dielectric constant, increase in radiation efficiency, high quality factor (Q) can be achieved and surface wave can also be removed [13][14]. The effective dielectric constant of the air-substrate mixture in the cavity can be calculated from equation (4) [15].…”

Section: Introduction To Micromachiningmentioning

confidence: 99%