High-efficiency and reliable same-parent thermoelectric modules using Mg3Sb2-based compounds

Abstract

Thermoelectric modules can convert waste heat directly into useful electricity, providing a clean and sustainable way to use fossil energy more efficiently. Mg3Sb2-based alloys have recently attracted considerable interest from the thermoelectric community due to their nontoxic nature, abundance of constituent elements, and excellent mechanical and thermoelectric properties. However, robust modules based on Mg3Sb2 have progressed less rapidly. Here, we develop multiple-pair thermoelectric modules consisting of both n-type and p-type Mg3Sb2-based alloys. Thermoelectric legs based on the same parent fit in each other in terms of thermomechanical properties, facilitating module fabrication and ensuring low thermal stress. By adopting a suitable diffusion barrier layer and developing a new joining technique, an integrated all Mg3Sb2-based module demonstrates a high efficiency of 7.5% at a temperature difference of 380 K, exceeding the state-of-the-art same-parent thermoelectric modules. Moreover, the efficiency remains stable during 150 thermal cycling shocks (∼225 h), demonstrating excellent module reliability.

A high performance eco-friendly MgAgSb-based thermoelectric power generation device near phase transition temperatures

“…This approach allowed us to quantitatively evaluate the magnitude of maximum thermal stresses. 62 The von Mises stress ranges from 0 to 0.1 MPa near the cold side ( T c = 5 °C), but it exceeds 12 MPa at T h = 350 °C. Notably, the maximum von Mises stress reaches 43.5 MPa at T h = 350 °C.…”

Achieving High Isotropic Figure of Merit in Cd and in Codoped Polycrystalline SnSe

“…1−6 In recent years, devices fabricated from high-performance thermoelectric materials have emerged as key players in the fields of power generation and refrigeration. 7,8 The performance of the thermoelectric materials is characterized by the dimensionless figure of merit (ZT), defined as ZT = S 2 σT/κ T , where S is the Seebeck coefficient, σ is the electrical conductivity, and the total thermal conductivity (κ T ) can be divided into electronic thermal conductivity (κ e ) and lattice thermal conductivity (κ L ). 9,10 The power factor (PF = S 2 σ) is commonly used to represent the electrical transport characteristic.…”

“…Thermoelectric materials, capable of realizing the direct conversion between heat and electricity, offer a promising solution for alleviating the escalating energy crisis and environmental issues. − In recent years, devices fabricated from high-performance thermoelectric materials have emerged as key players in the fields of power generation and refrigeration. , The performance of the thermoelectric materials is characterized by the dimensionless figure of merit ( ZT ), defined as ZT = S 2 σ T /κ T , where S is the Seebeck coefficient, σ is the electrical conductivity, and the total thermal conductivity (κ T ) can be divided into electronic thermal conductivity (κ e ) and lattice thermal conductivity (κ L ). , The power factor ( PF = S 2 σ) is commonly used to represent the electrical transport characteristic . However, the intricate interdependence among these parameters poses significant challenges for optimization.…”

Stepwise Alloying in Liquid-like Solid Solutions to Achieve Crystallographic Distortion for Regulating Thermoelectric Transport Behavior

“…Thermoelectric (TE) materials have no moving parts and can convert waste heat into electrical energy, which makes them particularly appealing in power generation and waste heat recycling. , The conversion efficiency of thermoelectric materials is gauged by the dimensionless figure of merit zT , which is defined as italiczT = α 2 σ κ T , (where α, σ, α 2 σ, κ, and T are the Seebeck coefficient, electrical conductivity, power factor, thermal conductivity, and absolute temperature, respectively) . For the relevant parameters, κ was easily adjusted in comparison with the other parameters, and it can be optimized by microstructure and stepwise alloying design .…”