2016
DOI: 10.1016/j.jallcom.2015.10.079
|View full text |Cite
|
Sign up to set email alerts
|

High dielectric constant in Al-doped ZnO ceramics using high-pressure treated powders

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

1
19
0

Year Published

2019
2019
2022
2022

Publication Types

Select...
7

Relationship

1
6

Authors

Journals

citations
Cited by 54 publications
(21 citation statements)
references
References 26 publications
1
19
0
Order By: Relevance
“…Three-dimensional pockets of the voids around the grain boundaries offer high surface area to the defects to be distributed and damage the conduction path of the charge carriers thereby increasing resistance to the transport of charge carriers. 48,50 For ZnO-1400 sample, we observe reduction in the values of R GB2 , which is suggested due to conversion of open voids to close voids due to grain growth as shown by Fig. 3(c).…”
Section: Impedance Analysismentioning
confidence: 71%
See 2 more Smart Citations
“…Three-dimensional pockets of the voids around the grain boundaries offer high surface area to the defects to be distributed and damage the conduction path of the charge carriers thereby increasing resistance to the transport of charge carriers. 48,50 For ZnO-1400 sample, we observe reduction in the values of R GB2 , which is suggested due to conversion of open voids to close voids due to grain growth as shown by Fig. 3(c).…”
Section: Impedance Analysismentioning
confidence: 71%
“…In ZnO and other ceramic oxides, the grain boundary resistance is generally higher in comparison to the grains due to segregation of point defects (i.e., oxygen vacancies, zinc interstitial and zinc vacancies) at grain boundaries. [47][48][49] In addition, voids exist in the form of three-dimensional pockets around the grain boundaries. The high surface area of the voids provides chance for the defects to be distributed and creates obstruction to the ow of charge carriers by reducing the conduction path and compressing current lines, analogous to the effect of impurities at grain boundaries.…”
Section: Impedance Analysismentioning
confidence: 99%
See 1 more Smart Citation
“…Figure 1a shows the comparison of peak positions before and after Sn-replaced Ti 3 AlC 2 . Compared with Ti 3 AlC 2 , the XRD peaks after adding Sn are shifted towards lower angles, such as (103), (104), and (105) peaks, which may be caused by the replacement of Al atoms by Sn atoms [15,24]. The peak strengths of (002), (004), and (006) peaks increased while that (100) peaks decreased, showing the periodic symmetry along the c-axis and the corresponding structural factors can be changed by replacing the atoms in the A layer.…”
Section: Synthesis Of Ti 3 Al(sn)c 2 Powdersmentioning
confidence: 97%
“…In order to meet the requirements of high-temperature and high-irradiation special environmental conditions, replacement methods are usually used to improve the properties of the MAX phase [8][9][10][11][12][13][14][15][16]. Tian et al found that the Vickers hardness of (Cr 1-x V x ) 2-AlC (x = 0, 0.1, 0.25, and 0.5) solid solution increased linearly with the increase of the amount of V introduced [9].…”
Section: Introductionmentioning
confidence: 99%