High Density Microbump Development for Multi-Project Wafer (MPW) Die.

Jordan, Matthew B.; Hollowell, Andrew E; Gutierrez, Jordan E.; McClain, Jonathan T.; Nordquist, Christopher; Michael, Christopher; Wood, Michael; Young, A. T.

doi:10.2172/1830984

Proposed for Presentation at the InterPACK Held October 27-29, 2020 in Anaheim, CA. 2020

DOI: 10.2172/1830984

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High Density Microbump Development for Multi-Project Wafer (MPW) Die.

Matthew B. Jordan¹,

Andrew E Hollowell²,

Jordan E. Gutierrez³

et al.

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High Density Microbump Development for Multi-Project Wafer (MPW) Die.

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