High-Density Low-Profile Coupled Inductor Design for Integrated Point-of-Load Converters

Li, Qiang; Dong, Yan; Lee, F. C.; Gilham, David

doi:10.1109/tpel.2012.2196525

Cited by 84 publications

(21 citation statements)

References 11 publications

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“…Table summarizes the performance comparison of previously reported LTCC‐based converters with those presented in this work. Although the reported LTCC‐based converters used a very high switching frequency of above 1 MHz to achieve a small form factor, their maximum output power is below 50 W, and their maximum output efficiency is 92.5% at an output power of approximately 6 W .…”

Section: Proposed Ltcc‐based Nonsynchronous Buck Convertermentioning

confidence: 99%

“…Our group has studied discrete power device packages with an embedded cavity in multilayer LTCC to reduce the parasitic inductance caused by wire bonding . Virginia's Polytechnic Institute and State University has studied planar inductors using magnetic tape and a multilayer LTCC manufacturing process to implement small‐size non‐isolated point‐of‐load (POL) converters . However, their maximum output power achieved is below 50 W, and the maximum output efficiency is 92.5% at an output power of approximately 6 W .…”

Section: Introductionmentioning

confidence: 99%

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Efficiency improvement of a DC/DC converter using LTCC substrate

et al. 2019

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Section: Proposed Ltcc‐based Nonsynchronous Buck Convertermentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Efficiency improvement of a DC/DC converter using LTCC substrate

et al. 2019

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“…In addition, the concern for the magnetic core structure of the LCI is increasing in recent years. For example, a low-profile coupled inductor (11) is suitable for the threedimensional structural circuit, or a multilayered coupled chip inductor is suitable for small converter such as point of load application (13) . Furthermore, EIE core structure for getting any coupling coefficient (22) ; split-winding structure for reducing parasitic capacitance between windings (7) ; and air-core coupled inductor suitable for high power application have been reported (9) .…”

Section: Introductionmentioning

confidence: 99%

Magnetic Analysis, Design, and Experimental Evaluations of Integrated Winding Coupled Inductors in Interleaved Converters

Imaoka¹,

Umetani

Kimura³

et al. 2016

IEEJ Journal IA

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Integrated magnetic components for interleaved converters have been developed in order to fulfill the demand for high power density and high efficiency in power conversion systems. The close-coupled inductor and the loosely coupled inductor methods for interleaved converters are well known as attractive techniques to downsize magnetic components or improve the power conversion efficiency. Moreover, the integrated winding coupled inductor has already been proposed. However, the advantages of the interleaved converter with the integrated winding coupled inductor over the other methods have not been fully elucidated. Consequently, this paper analyzes and evaluates the integrated winding coupled inductor, specifically, the characteristics of the inductor ripple current and the magnetic flux in the core. The analysis shows that the integrated winding coupled inductor provides attractive features compared with the other methods. The effectiveness of the integrated winding coupled inductor is discussed from theoretical and experimental points of view.

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“…The power inductor has presented one of the greatest impediments so far to the miniaturization of power converters [6]. With Moore's Law scaling resulting in ever more tightly integrated circuits for the control logic, the power inductor has tended to increasingly dominate the overall size of the smallest converters.…”

Section: Introductionmentioning

confidence: 99%

A Micromachined Wiring Board With Integrated Microinductor for Chip-Scale Power Conversion

Meyer

Bedair

Morgan

et al. 2014

IEEE Trans. Power Electron.

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This paper presents a multilayer wiring board that integrates a copper air-core microinductor to enable a highly compact, chip-scale power converter module. The wiring board is wafer-level fabricated with three 30-μm-thick electroplated copper layers and is subsequently detached from the fabrication wafer to yield a board that is only 90 μm thick for minimum overall module volume. Within this platform, a stacked-spiral air-core microinductor is designed for high-switching-frequency power conversion and yields high inductance density of 128 nH/mm 2 (100 nH/mm 3 by volume, including 600 μm clearances both above and below the inductor to minimize coupling with external conductors). Although this technology is anticipated to be more appropriate for emerging, experimental converters with switching frequencies >30 MHz, a proof-of-concept, ultraminiature (9 mm 2 footprint, 0.7 mm thick) power converter module is presented that utilizes the microinductor wiring board in conjunction with a commercially available surface-mount boost regulator (∼4 MHz switching frequency). The converter module yielded a maximum output power of 153 mW at 60% efficiency for a volumetric power density of 24 mW/mm 3 based on the physical volume occupied by the module (13 mW/mm 3 based on the volume needing to be kept clear from external conductors).

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High-Density Low-Profile Coupled Inductor Design for Integrated Point-of-Load Converters

Cited by 84 publications

References 11 publications

Efficiency improvement of a DC/DC converter using LTCC substrate

Efficiency improvement of a DC/DC converter using LTCC substrate

Magnetic Analysis, Design, and Experimental Evaluations of Integrated Winding Coupled Inductors in Interleaved Converters

A Micromachined Wiring Board With Integrated Microinductor for Chip-Scale Power Conversion

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