High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

Loeblein, Manuela; Tsang, Siu Hon; Pawlik, Matthieu; Phua, Eric Jian Rong; Han, Yongdian; Zhang, Xiaowu; Gan, Chee Lip; Teo, Edwin Hang Tong

doi:10.1021/acsnano.6b08218

Cited by 168 publications

(95 citation statements)

References 67 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Heat dissipation is a critical issue for many significant applications, especially for electronic equipment such as light‐emitting devices (LED) and integrated circuits, which always leads to fast aging or even failure of the core chips . To tackle this problem, thermal interface material (TIM) is usually implemented in electronic packaging to improve heat management . Polymer‐based TIM is widely accepted for its excellent electrical insulation, easy processability, and low cost, yet still largely limited by its low thermal conductivity .…”

Section: Introductionmentioning

confidence: 99%

An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre‐Mimetic 3D Network

Han

Gao

et al. 2019

Adv Funct Materials

490

281

View full text Add to dashboard Cite

Polymer-based thermal interface materials (TIMs) with excellent thermal conductivity and electrical resistivity are in high demand in the electronics industry. In the past decade, thermally conductive fillers, such as boron nitride nanosheets (BNNS), were usually incorporated into the polymer-based TIMs to improve their thermal conductivity for efficient heat management. However, the thermal performance of those composites means that they are still far from practical applications, mainly because of poor control over the 3D conductive network. In the present work, a high thermally conductive BNNS/ epoxy composite is fabricated by building a nacre-mimetic 3D conductive network within an epoxy resin matrix, realized by a unique bidirectional freezing technique. The as-prepared composite exhibits a high thermal conductivity (6.07 W m −1 K −1 ) at 15 vol% BNNS loading, outstanding electrical resistivity, and thermal stability, making it attractive to electronic packaging applications. In addition, this research provides a promising strategy to achieve high thermal conductive polymer-based TIMs by building efficient 3D conductive networks.The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adfm.201900412. graphene [12] (1-16 W m −1 K −1 ), and carbon nanotubes [13] (CNTs, 0.5-5 W m −1 K −1 ) are usually included in the polymer matrix. Among all those fillers, boron nitride (BN) is particularly outstanding for its high thermal conductivity, excellent electrical insulation, and low cost. [14] During the last decade, although many efforts have been made to develop BN-based polymer composite, [15][16][17][18] its real application as TIM is greatly hindered for its moderate thermal conductivity. This could be mainly attributed to the insufficient manipulation of the 3D conductive network. For the same reason, currently reported composites are usually thin films although there is an urgent need for bulk BN-based composite with high thermal conductivity.Here, a BN/epoxy composite with a nacre-mimetic 3D conductive network was constructed by a bidirectional freezing technique. [19][20][21] The boron nitride nanosheets (BNNS) were assembled into an aerogel with long-range aligned lamellar layers, followed by infiltration of epoxy resin. The highly organized 3D conductive network provides prolonged phonon pathways, yielding a much higher thermal conductivity (6.07 W m −1 K −1 ) at a relatively low BN loading (15 vol%) comparing to the similar composites in the literature. Together with its excellent electrical resistivity (2 × 10 12 Ω cm) and thermal stability (glass transition temperature: 120 °C), our composite may find wide applications including TIM for the advanced electronic packaging technology. Keywords3D conductive network, bidirectional freezing, boron nitride, long-range lamellar structure, thermal interface material

show abstract

Section: Introductionmentioning

confidence: 99%

An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre‐Mimetic 3D Network

Han

Gao

et al. 2019

Adv Funct Materials

490

281

View full text Add to dashboard Cite

show abstract

“…The recent rapid development of 2D materials provides new opportunities to reconsider these applications. Graphene and hybrid films have been used as a heat spreader that can reduce hot‐spot temperatures of up to 40 °C . Boron nitride nanosheets (BNNSs) are one of the 2D materials that could be considered.…”

Section: Introductionmentioning

confidence: 99%

Bulk Hexagonal Boron Nitride with a Quasi‐Isotropic Thermal Conductivity

Mateti

Yang

et al. 2018

Adv Funct Materials

View full text Add to dashboard Cite

Hexagonal boron nitride (BN) is electrically insulating and has a high in‐plane thermal conductivity. However, it has a very low cross‐plane thermal conductivity which limits its application for efficient heat dissipation. Here, large BN pellets with a quasi‐isotropic thermal conductivity are produced from BN nanosheets using a spark plasma sintering (SPS) technique. The BN pellets have the same thermal conductivity from both perpendicular and parallel directions to the pellet surface. The high quasi‐isotropic thermal conductivity of the bulk BN is attributed to a quasi‐isotropic structure formed during the SPS process in which the charged BN nanosheets form large sheets in all directions under two opposite forces of SPS compression and electric field. The pellet sintered at 2300 °C has a very high cross‐section thermal conductivity of 280 W m−1 K−1 (parallel to the SPS pressing direction) and exhibits superior heat dissipation performance due to more efficient heat transfer in the vertical direction.

show abstract

“…When graphene sheets are dispersed in the matrix, plenty of interfaces exist, and the high thermal resistances at the interfaces are caused by the difference of phonon density between graphene and matrix . Recently, it is widely accepted that converting individually dispersed graphene into 3D continuous network can effectively decrease the amount of interfaces and decrease the interfacial thermal resistance . In addition, the prefabricated 3D skeleton ensures the uniform and stable distribution of graphene.…”

mentioning

confidence: 99%

3D Thermally Cross‐Linked Graphene Aerogel–Enhanced Silicone Rubber Elastomer as Thermal Interface Material

Zhang

Kong

Tao

et al. 2019

Adv Materials Inter

View full text Add to dashboard Cite

show abstract

High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

Cited by 168 publications

References 67 publications

An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre‐Mimetic 3D Network

An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre‐Mimetic 3D Network

Bulk Hexagonal Boron Nitride with a Quasi‐Isotropic Thermal Conductivity

3D Thermally Cross‐Linked Graphene Aerogel–Enhanced Silicone Rubber Elastomer as Thermal Interface Material

Contact Info

Product

Resources

About