High data-rate communication link at 240 GHz with on-chip antenna-integrated transmitter and receiver modules in SiGe HBT technology

Grzyb, Janusz; Vazquez, Pedro Rodriguez; Sarmah, Neelanjan; Förster, Wolfgang; Heinemann, B.; Pfeiffer, Ullrich R.

doi:10.23919/eucap.2017.7928160

Cited by 15 publications

(9 citation statements)

References 12 publications

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“…Recently, a new standard has been established by the IEEE [1], emerging from the THz wireless communications research that has been very intensive these past years [2]. Many technologies offer interesting features for THz communications, for example, III-V electronics can offer long-distance links [3], silicon germanium electronics are growing very fast for radar and communications applications [4]. Also, resonant tunnelling diodes devices have shown good performances for short-range links [5].…”

mentioning

confidence: 99%

Single‐channel 100 Gbit/s transmission using III–V UTC‐PDs for future IEEE 802.15.3d wireless links in the 300 GHz band

et al. 2018

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The achievement of single-channel 100 Gbit/s transmission, using linear unitravelling carrier photodiodes and QAM-16 modulation format is reported. The wireless link has been done in the indoor case, considering the recent frequency standardised 300 GHz bands. 'TERALINKS', ANR-DFG 'TERASONIC' projects. Part of the work was realised under an academic collaboration with Tektronix. In particular, a 50 GS/s arbitrary waveform generator (Tektronix AWG70001A) and 200 GS/s real-time oscilloscope (Tektronix DPO77002SX) were used. We also thank the IEMN, characterisation centre, IEMN-IRCICA Telecom platform facilities. This work is supported by the CPER 'Photonics for society', and contribute the 'digital world' Hub 3 of the

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confidence: 99%

Single‐channel 100 Gbit/s transmission using III–V UTC‐PDs for future IEEE 802.15.3d wireless links in the 300 GHz band

et al. 2018

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“…Few standalone AoCs have also been proposed. Third, the gain of a large proportion of the MM-Wave AoCs is low except the AoCs of [77]- [79] because of the use of the Si lens, and of [80] due to the use of high-resistivity substrate. This degraded gain pushes the need for the use of gain enhancement methods for these AoCs.…”

Section: A Applications In Mm-wave Bandmentioning

confidence: 99%

“…As far as the technology is concerned, Silicon (Si) based technologies (Complementary Metal Oxide Semiconductor (CMOS) and Silicon Germanium (SiGe) Bipolar CMOS (BiCMOS)) have become an attractive choice for the AoC's design nowadays because of their variety of benefits such as reduced cost, small chip-size, low power, high integration level, and the accessibility to several processes. Moreover, the unity-gain frequency (f t ) and unity-power-gain frequency (f max ) of MOS transistors have now been pushed well beyond 300 GHz in some SiGe CMOS processes [79], thus enabling the realization of AoCs design for MM-Wave and THz applications. In fact, the value of f max for the MOS transistors has now reached up-to 570 GHz [30], which is achieved by integrating the Infinion's 130 nm process with the IHP's advanced SiGe HBT module with an elevated extrinsic base and non selective epitaxial-bases deposition [31].…”

Section: Introductionmentioning

confidence: 99%

The Potentials, Challenges, and Future Directions of On-Chip-Antennas for Emerging Wireless Applications—A Comprehensive Survey

et al. 2019

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The ever-growing demand for low power, high performance, cost-effective, low-profile, and highly integrated wireless systems for emerging applications has triggered the need for the enormous innovations in wireless transceiver systems, components, architectures and technologies. This is especially valid for the antenna which is an integral component of the wireless transceiver systems and contributes significantly in determining their overall performance. Antenna-on-Chip (AoC) is an alternative antenna technology, which has drawn a substantial attention in recent days because of its various benefits over off-chip antenna technology. A few of these benefits include miniaturization, low power, low cost, and high integration of the wireless modules. Motivated by these valuable advantages and to unveil the true potential of the AoCs, this article presents, for the first time, a comprehensive survey of the suitability, advantages, and challenges of the AoCs for the emerging wireless applications such as 5th generation (5G) Wireless Systems, Internet-of-Things (IoT) Wireless Devices and Systems, Wireless Sensor Networks (WSNs), Wireless Interconnects, Wireless Energy Transfer, Radio Frequency (RF) Energy Harvesting, Biomedical Implants, Unmanned Aerial Vehicles (UAVs), Autonomous vehicles, Innovative characterization methods for Integrated Circuits (ICs) and Antennas, and Smart City. In addition, this article presents the current stateof-the-art of the AoC's applications by classifying their applications in Millimeter-Wave (MM-Wave) band, Terahertz (THz) band, and low-frequency bands. The article also investigates and describes some useful methods for the mitigation of the challenges and issues posed by the emerging applications for the realization of the AoCs in a systematic manner. A concise description of the future directions of the AoCs with respect to each emerging application is also a part of this article. It is expected that this well-structured and organized survey will not only act as an excellent source of scholarship for the relevant research community, but also open up a world of novel research opportunities.

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“…In these days, as ever-increasing demand on the required operational bandwidth due to the limited throughput of wireless link with current 5G mm-Wave frequency bands [1], sub-terahertz (sub-THz) and THz frequency bands are getting increasingly more focus and promising for future THz wireless systems with more than 100 Gbps or even one Tbps achievable date rate [2] [3]. Antenna implementation on traditional mm-Wave domain allows the use of System-on-package (SoP) solutions in which the the antenna elements are achieved by using low-loss microwave substrates and connected to RFIC modules through a certain feeding network and interconnects e.g.…”

Section: Introductionmentioning

confidence: 99%

A Multiple-Feed Connected Leaky Slot Antenna for In-Antenna Power Combining in 0.13 μm SiGe BiCMOS Technology

Chen

Berg

et al. 2020

2020 14th European Conference on Antennas and Propagation (EuCAP)

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In this paper, a differentially-driven wideband multiple-feed on-chip antenna design in 0.13 µm SiGe technology is proposed for millimeter-wave power combining applications. The in-antenna power combining concept is achieved by combining parallel amplifiers in the multi-port radiator where each port corresponds directly to a differential power amplifier (PA) stage. Specifically, the radiator is composed of a leaky slot with multiple set of differential microstrip feed lines. A wideband Marchand balun with 1.5 dB insertion loss is applied to convert the differential output to the single-ended input of microstrip feed line. In addition, the proposed differential PA has a combined output power of 10 dBm and its output is directly connected with the balun. As a result, the proposed multiple-feed antenna has four differential microstrip feed lines connected with four Marchand baluns which are driven by four parallel differential PAs respectively. Also, to compensate for the loss along the signal route such as power splitters and baluns, pre-amplification PA stage is a necessity at the input of each PA stage. In order to suppress the surface waves in the high permittivity substrate, an extended hemispherical silicon lens is integrated with the chip. Simulation results show that the antenna can cover more than 50 % fractional bandwidth at 250 GHz and calculated EIRP is 19.3 dBm. Index Terms-on-chip antenna, connected slot antenna, power combining, multiple-port antenna, SiGe BiCOMS.

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High data-rate communication link at 240 GHz with on-chip antenna-integrated transmitter and receiver modules in SiGe HBT technology

Cited by 15 publications

References 12 publications

Single‐channel 100 Gbit/s transmission using III–V UTC‐PDs for future IEEE 802.15.3d wireless links in the 300 GHz band

Single‐channel 100 Gbit/s transmission using III–V UTC‐PDs for future IEEE 802.15.3d wireless links in the 300 GHz band

The Potentials, Challenges, and Future Directions of On-Chip-Antennas for Emerging Wireless Applications—A Comprehensive Survey

A Multiple-Feed Connected Leaky Slot Antenna for In-Antenna Power Combining in 0.13 μm SiGe BiCMOS Technology

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