High Cooling Rate, Regular and Plate Like Cells in Sn–Ni Solder Alloys

Xavier, Marcella G. C.; Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo

doi:10.1002/adem.201701179

Cited by 5 publications

(9 citation statements)

References 21 publications

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“…The cellular ( λ C —sample: 5 mm) and primary ( λ 1 ) dendritic spacing values ranged from 36.6 to 267.7 μm related to positions in the DS casting in the range 5–90 mm from the metal/mold interface, respectively. This type of (cellular) growth has been also observed by Silva and co‐workers [ 30 ] for Sn–Cu–Ni alloys, by Xavier et al [ 33 ] for Sn–Ni alloys, and by Spinelli et al [ 32 ] for Bi–Ag alloys.…”

Section: Resultssupporting

confidence: 76%

“…[36] For the Sn-3.5 wt% Ag and Sn-3.5 wt% Ag-0.5 wt% Zn alloys, the evolutions of λ 1 and λ 3 with the cooling rate were described by a À0.5 experimental exponent. This exponent is similar to the experimental exponents used to describe the variations of λ 1 and λ 3 against Ṫ of other Sn-based alloys such as Sn-Zn, [37] Sn-Sb, [31] Sn-Ni, [33] Sn-Bi-Cu, [38] Sn-Cu, and Sn-Cu-Ag. [39] In the case of the modified Sn-3.5 wt% Ag-0.5 wt% Zn alloy, which showed a cellular-dendritic transition, eutectic cells prevailed for cooling rates greater than 8.55 °C s À1 .…”

Section: Macrostructures As-cast Microstructures Andsupporting

confidence: 71%

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Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

et al. 2022

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Sn-Ag-based alloys are considered good alternatives to soldering operations as compared with the traditional Sn-Pb solder alloys. Herein, the effects of 0.5 and 1.0 wt% Zn additions to a Sn-3.5 wt% Ag eutectic alloy on cooling and growth rates, microstructure, and microhardness along the length of directionally solidified (DS) castings are examined. Characterization techniques such as optical microscopy (OM), scanning electron microscopy (SEM), X-ray fluorescence (XRF), X-ray diffraction (XRD), and Vickers microhardness are used to examine different samples extracted along the length of the DS castings. The Sn-3.5 wt% Ag alloy is shown to have a fully dendritic microstructure, characterized by a Sn-rich matrix with the eutectic mixture located in the interdendritic regions. On the other hand, the alloy modified with 1 wt% Zn exhibits a microstructure entirely formed by β-Sn cells, with a mixture of β-Sn, ε-Ag 3 Sn, and ζ-AgZn phases in the intercellular regions. The DS Sn-3.5 wt% Ag-0.5 wt% Zn alloy casting exhibits a cellular/dendritic transition at a critical cooling rate of 8.5 °C s À1 . The 0.5 wt% and 1 wt% Zn additions to the Sn-3.5 wt% Ag alloy improve hardness by 42.6% and 47.5%, respectively.

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Section: Resultssupporting

confidence: 76%

Section: Macrostructures As-cast Microstructures Andsupporting

confidence: 71%

Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

et al. 2022

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“…Extracted from the primary dendritic spacing (λ 1 ) correlations as a function of the cooling rate (T ̇) along the Sn-0.2 wt % Ni-0.2 wt % Zn and Sn-0.2 wt % Ni-0.5 wt % Zn alloy castings, Figure 8 displays the experimental equations reflecting microstructural growth. To assess the impact of the Zn content, the experimental expressions published by Xavier et al 5 were also incorporated into the plots. The 40 measurements�mean microstructural spacing and corresponding mean variances�are shown as points on the graphs.…”

Section: Microstructural Scaling Relationshipsmentioning

confidence: 99%

“…The experimental exponents used for the Sn−Ni−Zn alloys are similar to those reported (−0.5 and −0.55) to describe the evolution of λ 1 as a function of T ̇for other tin-based alloys such as Sn−Ag−Zn 27 and Sn−Ni. 5 2.3. Phases Formed, Segregation, and Cytotoxicity.…”

Section: Microstructural Scaling Relationshipsmentioning

confidence: 99%

“…Lead-free soldering tin-based alloys have been proposed in the last years, especially Sn–Ni alloys, maintained as binary or modified with additional alloying. , Binary Sn–Ni alloys have a high potential for application in electronic components due to their suitable corrosion resistance and good weldability, in addition to their hypereutectic, eutectic, and hypoeutectic compositions requiring low levels of Ni, which is a cost advantage . According to the literature, the eutectic reaction of the Sn–Ni system at equilibrium is L (liquid) → (Sn) + Ni 3 Sn 4 , and Ni has negligible solubility in Sn at 231.15 °C .…”

Section: Introductionmentioning

confidence: 99%

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Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders

Paixão,

Batista de Sousa,

Dantas de Freitas

et al. 2024

ACS Omega

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Sn−Ni system alloys are promising alternatives to replace Sn−Pb alloys as they exhibit high corrosion resistance and good weldability. However, Sn−Ni alloys still have low mechanical strength and low reliability. Using the strategy of the addition of alloying elements can be a way to improve the properties of Sn−Ni alloys. Zinc (Zn) plays an essential role in the lead-free solder alloys sector by mitigating the growth of intermetallic compounds in soldered joints, refining the microstructure, enhancing the mechanical strength, and ultimately reducing the overall cost. This study aims to explore the impacts of Zn additions (0.2 and 0.5 wt %) on thermal parameters (growth rate-V and cooling rate-T ̇), macrostructure, microstructure, phase transformation, macrosegregation, and cytotoxicity. All of these factors will be examined in directionally solidified Sn-0.2 wt % Ni alloys under transient heat flow conditions on a copper sheet. The samples underwent characterization using optical microscopy, scanning electron microscopy, X-ray fluorescence, and X-ray diffraction. Property diagrams and isopleths were generated by using the CALPHAD method. Cytotoxicity analysis involved assessing cell viability after 15 and 30 days of incubation for the alloys, followed by exposure of the extracts for 24 and 48 h. The Zn additions caused a significant increase in the melting temperature in the Sn−Ni−Zn alloys. Fully columnar macrostructures were observed for the Sn−Ni−Zn alloys. The as-cast microstructures of Sn−Ni−Zn alloys were completely dendritic, with an Sn-rich matrix (Sn-β) surrounded by a Ni 3 Sn 4 + NiSn + Sn-β phase eutectic mixture. Zn additions did not change the dendritic arrangement of the Sn−Ni−Zn alloys when compared to the Sn-0.2 wt % Ni. Furthermore, increasing the Zn content did not affect the microstructural scale in the ternary Sn−Ni−Zn alloys. The toxicity of the examined alloys is not significantly influenced by the microstructural length scale. On the other hand, factors such as incubation time and chemical composition may have an impact on the cytotoxicity. Overall, the presence of Zn in the Sn−Ni−Zn alloys enhanced the cell viability.

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Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth

Oliveira

Cruz

Barros

et al. 2021

J Therm Anal Calorim

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High Cooling Rate, Regular and Plate Like Cells in Sn–Ni Solder Alloys

Cited by 5 publications

References 21 publications

Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders

Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth

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