High aspect ratio structures obtained by electroforming in microstructured glass

Hülsenberg, Dagmar; Harnisch, Alf; Jakob, C.; May, Matthias M.; Straube, B.

doi:10.1007/bf02739540

Cited by 5 publications

(2 citation statements)

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“…In our previous study, we showed that effective fluid filling into microchannels can be achieved using centrifugal force (Tsai et al 2004a). Other alternatives were also proposed by other investigators (Hulsenberg et al 1996). The second difficulty associated with high aspect ratio structure electroforming involves depositing a sufficient supply of metal ions into the microstructures for electrodeposition.…”

Section: Introductionmentioning

confidence: 94%

High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process

et al. 2005

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This paper describes a theoretical model that predicts the metal ion concentration distribution during electroforming high aspect ratio microstructures (HARM). The applied current density and microstructure aspect ratio were found as two important factors that affect the electroforming outcome. The analytical results are verified using experiments that electroforming microstructural posts with an aspect ratio of 10. Good agreement was obtained between the experimental and analytical solutions. Based on the ion concentration analytical prediction on the cathode surface, one can estimate the electroforming time required for fabricating a microstructure for a given aspect ratio

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Section: Introductionmentioning

confidence: 94%

High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process

et al. 2005

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“…Problem areas are the fotoresist, PMMA plastic, the high depth of the structures, the long exposure time and high costs. An alternative solution is UV-lithography (UVL) with fotosensitive glass [5]. This technology is better suited for deeper structures, avoids all the problems with organic materials and is appreciably cheaper.…”

Section: Introductionmentioning

confidence: 99%

Planar millimeter-wave RF structures

Henke

1997

The Seventh Workshop on Advanced Accelerator Concepts

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Recently RF-structures have been proposed for frequencies between 30 and 140 GHz. These structures are planar and doublesided (open) and suited for fabrication by lithography. Two technologies are available: Deep X-rays with plastic resists (thickness < 0.8mm) or UV-light with doped glass resists (thickness up to several mm). The paper presents structure developments for different applications. The status of wafer manufacture, fabrication and alignment techniques will be discussed.

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Liquid Glass: A Facile Soft Replication Method for Structuring Glass

et al. 2016

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Liquid glass is a photocurable amorphous silica nanocomposite that can be structured using soft replication molds and turned into glass via thermal debinding and sintering. Simple polymer bonding techniques allow the fabrication of complex microsystems in glass like microfluidic chips. Liquid glass is a step toward prototyping of glass microstructures at low cost without requiring cleanroom facilities or hazardous chemicals.

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High aspect ratio structures obtained by electroforming in microstructured glass

Cited by 5 publications

References 0 publications

High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process

High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process

Planar millimeter-wave RF structures

Liquid Glass: A Facile Soft Replication Method for Structuring Glass

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